Berlin, May 22, 2020: Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for PCB, semiconductor advanced packaging, and dual-damascene applications, will participate in this year¡¯s IEEE 70th Electronic Components and Technology Conference (ECTC). The virtual conference will be held from June 3 through 30, 2020.
Atotech will give two technical paper presentations, both of which will be available for viewing during the time the conference is open:
- Dr. Britta Schafsteller, Atotech expert in Final Finishing, will talk about ¡°Autocatalytic tin ¨C how to overcome process limitations to introduce a new solution for thick tin plating¡±.
- Dr. Tobias Bernhard, Atotech expert in Plating Through Hole, will share his insights on ¡°Nickel dependence of hydrogen co-deposition and nanoporosity for electroless deposited Cu-films¡±.
Dr. Britta Schafsteller and Dr. Tobias Bernhard
Conference: 2020 IEEE 70th Electronic Components and Technology Conference
Date: June 3 ¨C 30, 2020
For more information, please visit: