Berlin, January 7, 2020: Atotech, a leading surface-finishing solutions provider, delivering chemistry, equipment, and service to support diverse end-markets such as mobile devices, computers, consumer electronics, the global automotive industries, and many others, will present at the 34th Electronics R&D, Manufacturing and Packaging Technology Expo ¨C NEPCON JAPAN, Tokyo Big Sight Japan, on January 15th ¨C 17th.
Visitors of the event are welcome to stop by the company¡¯s booth W9-60 to discuss hot industry trends, latest product innovations and the company’s development outlook for the coming year.
Atotech¡¯s key highlights at NEPCON JAPAN include:
- vPlate? ¨C New vertical continuous copper plating equipment for advanced HDI and IC substrate
- Polygon? PLB Line? ¨C New desmear and electroless copper metallization equipment
- ViaKing? ¨C A new enhanced graphite direct metallization process for flex and advanced base materials
- Printoganth? P2 ¨C A new universal horizontal e¡¯less Cu system for flex, flex-rigid, HDI & MLB base materials
- InPro? SAP3 ¨C IC substrate via filling process for best uniformity at high current density
- InPro? PI ¨C Copper pillar plating process for high interconnect density
- PallaBond? ¨C A new direct pure EPAG surface finish for ultra-fine L/S application
- Stanna-COF ¨C Immersion tin process for chip-on-film applications
- CovaBond? P100 ¨C Adhesion promoter for plating on polyimide COF, flex HDI, mSAP, SAP
- Novabond? EX ¨C A new generation adhesion promoter for advanced IC substrate manufacturing
- AgPrep? ¨C Ultimate non-etching adhesion promoter for silver surfaces
- Argalin? XL ¨C High performance inorganic and Cr(VI)-free silver anti-tarnish process
- Spherolyte? UF3 ¨C High speed copper deposition for pillar applications
- Xenolyte? NI TR ¨C High temperature resistant Ni for RDL and pad metallization