{"id":11203,"date":"2017-02-21T16:23:04","date_gmt":"2017-02-21T16:23:04","guid":{"rendered":"https:\/\/www.atotech.com\/?p=11203\/"},"modified":"2017-06-01T09:09:05","modified_gmt":"2017-06-01T09:09:05","slug":"atotech-to-sponsor-iss-europe2017-electronics","status":"publish","type":"post","link":"https:\/\/www.atotech.com\/cn\/atotech-to-sponsor-iss-europe2017-electronics\/","title":{"rendered":"Atotech to sponsor ISS Europe 2017 || Electronics"},"content":{"rendered":"
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Atotech to sponsor ISS Europe 2017<\/strong><\/p>\n Atotech is a proud sponsor of the SEMI Industry Strategy Symposium (ISS) Europe, which takes place from March 5 to 7 in Munich, Germany. As official sponsor of the \u201cLucky Draw,\u201d an Atotech representative will have the pleasure of presenting one lucky visitor with an iPad Air. Participants are encouraged to submit their business cards on-site at ISS Europe for a chance to win. The winners\u2019 business card will be drawn out of the box in the morning of the second day (Tuesday).<\/p>\n Atotech invites ISS members to stop by our table to learn about our market leading products and innovative solutions for next generation packaging challenges. Product experts will be available to provide key information regarding our products and discuss the latest packaging trends.<\/p>\n Prior to the Symposium, read about our plating solutions for fan-out packaging in our article \u201cFan-out packaging: a key enabler for optimal performance in mobile devices,\u201d published in the January\/ February edition of Chip Scale Review. You can find the full article here<\/a>.<\/p>\n The article details why fan-out is the ideal packaging technology for future generation mobile devices and presents a turnkey electroplating solution for manufacture within both wafer and panel formats.<\/p>\n Atotech representatives look forward to meeting you in Munich.<\/p>\n