  {"id":19923,"date":"2018-06-14T12:27:13","date_gmt":"2018-06-14T10:27:13","guid":{"rendered":"https:\/\/www.atotech.com\/cupracid-flex-and-inpro-flex-advanced-copper-plating-processes-for-flex-pcbs-electronics\/"},"modified":"2018-07-24T09:18:08","modified_gmt":"2018-07-24T07:18:08","slug":"cupracid-flex-and-inpro-flex-advanced-copper-plating-processes-for-flex-pcbs-electronics","status":"publish","type":"post","link":"https:\/\/www.atotech.com\/cn\/cupracid-flex-and-inpro-flex-advanced-copper-plating-processes-for-flex-pcbs-electronics\/","title":{"rendered":"Cupracid\u00ae Flex and InPro\u00ae Flex: Advanced copper plating processes for Flex-PCBs || Electronics"},"content":{"rendered":"<p>[et_pb_section bb_built=&#8221;1&#8243; admin_label=&#8221;section&#8221; disabled_on=&#8221;off|off|off&#8221; disabled=&#8221;off&#8221;][et_pb_row background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221;][et_pb_column type=&#8221;1_3&#8243;][et_pb_image src=&#8221;https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/06\/CupracidFlex_InProFlex.jpg&#8221; sticky=&#8221;off&#8221; border_style=&#8221;solid&#8221; _builder_version=&#8221;3.2.2&#8243; \/][et_pb_text _builder_version=&#8221;3.2.2&#8243; border_style=&#8221;solid&#8221;]<\/p>\n<p>Excellent throwing power: Board thickness: 0.3mm, Hole: 0.15mm, CD: 2.8ASD, Line speed: 0.6m\/min, Flow rate: 15HZ, Average TP% : 120%<\/p>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8221;2_3&#8243;][et_pb_text admin_label=&#8221;Atotech to introduce Cupracid\u00ae Flex and InPro\u00ae Flex, two new advanced copper plating processes for Flex-PCBs&#8221; text_font_size=&#8221;18&#8243; border_style=&#8221;solid&#8221; _builder_version=&#8221;3.2.2&#8243;]<\/p>\n<p><strong>Berlin, 14 June, 2018:<\/strong> The flex\/ flex-rigid PCB market continues to grow as more and more designs call for flexible inner layers with ever finer lines and spaces. At the same time, the need for high volume reel to reel formats as well as pattern plating with lower base copper thickness drives the FPCB market.<\/p>\n<p>As one of the market leaders for BMV filling and through hole filling in the IC-Substrate market, Atotech has developed two new acid copper processes \u2013 InPro\u00ae Flex and Cupracid\u00ae Flex \u2013 to serve the flexible printed circuit board market and support its customers to overcome the current technical barriers in FPCB manufacturing.<\/p>\n<p><strong>Cupracid\u00ae Flex and InPro\u00ae Flex<\/strong><\/p>\n<p>\u201cCupracid\u00ae Flex and InPro\u00ae Flex are specifically designed for standard conformal flex and rigid-flex applications. While the Cupracid\u00ae Flex process is for use in vertical systems with soluble anodes, InPro\u00ae Flex can be used in systems with insoluble anodes,\u201d states Mustafa Oezkoek, Global Product Manager Panel and Pattern Plating at Atotech Deutschland GmbH.<\/p>\n<p>The simple two additive processes can be analyzed by standard CVS method and are suitable for vertical equipment or vertical reel to reel equipment with educator or sparger systems. They can be operated in panel and pattern plating and provide excellent line shape, outstanding crystal structure and a ductility of more than 23% in either manufacturing method.<\/p>\n<p><strong>Features and benefits<\/strong><\/p>\n<p>\u201cCupracid\u00ae Flex and InPro\u00ae Flex are highly reliable processes and deliver excellent physical properties,\u201d continues Mustafa. \u201cBoth solutions assure first-rate throwing power at high current densities without any corner flattening. At the same time, pattern uniformity and line shape are very good. And, according to IPC, the bending performance is exceptional.\u201d <\/p>\n<p>Both products have been rolled out globally and are available worldwide.<\/p>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section]<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Atotech has developed two new acid copper processes \u2013 InPro\u00ae Flex and Cupracid\u00ae Flex \u2013 to serve the flexible printed circuit board market and support its customers to overcome the current technical barriers in FPCB manufacturing.<\/p>\n","protected":false},"author":4,"featured_media":19223,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"","iawp_total_views":3,"footnotes":""},"categories":[113],"tags":[],"class_list":["post-19923","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press-releases-cn"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts\/19923","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/users\/4"}],"replies":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/comments?post=19923"}],"version-history":[{"count":0,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts\/19923\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/media\/19223"}],"wp:attachment":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/media?parent=19923"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/categories?post=19923"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/tags?post=19923"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}