{"id":45782,"date":"2018-11-09T12:28:28","date_gmt":"2018-11-09T11:28:28","guid":{"rendered":"https:\/\/www.atotech.com\/atotech-to-present-at-semicon-europa-and-electronica-2018-electronics\/"},"modified":"2019-05-16T12:29:21","modified_gmt":"2019-05-16T10:29:21","slug":"atotech-to-present-at-semicon-europa-and-electronica-2018-electronics","status":"publish","type":"post","link":"https:\/\/www.atotech.com\/cn\/atotech-to-present-at-semicon-europa-and-electronica-2018-electronics\/","title":{"rendered":"Atotech to present at SEMICON Europa and electronica 2018 || Electronics"},"content":{"rendered":"<p>[et_pb_section bb_built=&#8221;1&#8243; admin_label=&#8221;section&#8221; disabled_on=&#8221;off|off|off&#8221; disabled=&#8221;off&#8221;][et_pb_row background_position=&#8221;top_left&#8221; background_repeat=&#8221;repeat&#8221; background_size=&#8221;initial&#8221;][et_pb_column type=&#8221;1_3&#8243;][et_pb_image src=&#8221;https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/11\/Plating-fine-lines-Cu-pads.jpg&#8221; sticky=&#8221;off&#8221; border_style=&#8221;solid&#8221; _builder_version=&#8221;3.2.2&#8243; \/][et_pb_text _builder_version=&#8221;3.2.2&#8243;]<\/p>\n<p>Plating fine lines, Cu pads<\/p>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8221;2_3&#8243;][et_pb_text admin_label=&#8221;Atotech to present at SEMICON Europa and electronica 2018 &#8221; text_font_size=&#8221;18&#8243; _builder_version=&#8221;3.17.6&#8243;]<\/p>\n<p>Atotech Group, a leading chemical and equipment supplier for PCB, semiconductor advanced packaging and dual damascene applications, will exhibit and present its latest products for power, automotive, and mobile semiconductor applications at this year\u2019s SEMICON Europa. Atotech\u2019s Semiconductor portfolio includes RDL and pillar plating solutions for next generation FOWLP and 5G applications as well as solutions for electroless pad metallization and double side plating for power semiconductors.<\/p>\n<p>SEMICON Europa is the largest and most influential gathering for the semiconductor industry in Europe and attracts more thought leaders from overseas every year. This year the SEMICON show will be co-located with electronica, an equivalently important show for the printed circuit board and electronics assembly industry. Both events take place in Munich, Germany, from November 13 to 16, 2018. While Hall A4 will be dedicated to SEMICON Europa, Hall B5 will feature electronica.<\/p>\n<p>Atotech\u2019s product experts will be present at booth 569 in Hall A4 to discuss latest technology, trends, and future requirements. This year\u2019s product features include:\n<\/p>\n<ul>\n<li>Spherolyte\u00ae Cu UF3 &#8211; High purity ECD copper process for fine line RDL plating and microvia filling capability<\/li>\n<li>Spherolyte\u00ae Cu VR &#8211; Electrochemical copper process for fine line plating and simultaneous filling of various via dimensions<\/li>\n<li>Xenolyte\u00ae Ni TR &#8211; A high-temperature resistant electroless nickel process for RDL and pad metallization<\/li>\n<li>Spherolyte\u00aeCu MD2 and MultiPlate\u00ae &#8211; A new low stress ECD copper process for power semiconductors that is developed to run in Atotech\u2019s next generation semiconductor plating tool: MultiPlate\u00ae<\/li>\n<\/ul>\n<p>Atotech experts will also participate in the adjacent program with several presentations:\n<\/p>\n<ul>\n<li>On Tuesday, Nov. 13, at 4:40 pm,  Ulrich Memmert, Senior Scientist Material Sciences, will talk about \u201cMechanical properties of copper for advanced packaging\u201d at the Strategic Materials Conference in Room 14a  <\/li>\n<li>On Wednesday, Nov. 14, at 12:55 pm,  Ralf Schmidt, R&amp;D Manager Semiconductor, will introduce the audience to the \u201cEnhanced mechanical properties of copper for fan-out wafer level packaging applications\u201d at the Advanced Packaging Conference in Room 13b <\/li>\n<li>On Thursday, Nov. 15, at 10:45 am, Markus Hoerburger, Global Product Manager Semiconductor &amp; Functional Electronics Coatings, will talk about \u201cOptimized Cu plating solution for next generation packaging&#8221; at the TechLounge on the show floor in Hall A4 <\/li>\n<li>Also on Thursday, Nov. 15, at 4:35 pm, Andreas Walter, Team Manager Semiconductor Electroless Processes, will discuss  \u201cElectroless ternary nickel alloys for under bump metallization (UBM) on power semiconductors for high temperature process conditions or applications\u201d at the TechArena 2, Hall A4<\/li>\n<li>As part of the adjacent electronica, Roger Massey, Technical Marketing Manager, will present \u201cRecent developments in advanced HDI PCBs\u201d at the \u201cPCB &amp; Components marketplace\u201d in Hall A1 on Friday, Nov. 16, at 10:00 am.<\/li>\n<\/ul>\n<p>Visitors to the show are invited to attend Atotech\u2019s presentations and stop by at booth 569 in Hall A4 to discuss and elaborate on these and other topics and trends driving the industry.<\/p>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section]<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Atotech\u2019s product experts will be present at booth 569 in Hall A4 to discuss latest technology, trends, and future requirements.<\/p>\n","protected":false},"author":4,"featured_media":43796,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"","iawp_total_views":1,"footnotes":""},"categories":[113],"tags":[],"class_list":["post-45782","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press-releases-cn"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts\/45782","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/users\/4"}],"replies":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/comments?post=45782"}],"version-history":[{"count":0,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts\/45782\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/media\/43796"}],"wp:attachment":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/media?parent=45782"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/categories?post=45782"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/tags?post=45782"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}