[et_pb_section bb_built=”1″ admin_label=”section” disabled_on=”off|off|off” disabled=”off”][et_pb_row background_position=”top_left” background_repeat=”repeat” background_size=”initial”][et_pb_column type=”1_3″][et_pb_image src=”https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/11\/SEM-micrographs-of-copper-structure.jpg” _builder_version=”3.17.6″ animation_style=”slide” animation_duration=”500ms” animation_intensity_slide=”10%” animation_direction=”left” \/][et_pb_text _builder_version=”3.17.6″]<\/p>\n
SEM micrographs of copper structure after annealing (125\u00b0C, 4h) deposited at 3 ASD with the novel chemistry<\/p>\n
[\/et_pb_text][\/et_pb_column][et_pb_column type=”2_3″][et_pb_text admin_label=”Atotech\u2019s laser direct drilling pretreatment for advanced mSAP applications” text_font_size=”18″ _builder_version=”3.17.6″]<\/p>\n
Atotech, one of the leading companies worldwide in providing specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries, will present at this year\u2019s Electronics Packaging Technology Conference (EPTC) held at the Resorts World Sentosa in Singapore from December 4 to 7, 2018.<\/p>\n
On December 6, 2018, from 5:00 to 5:25 pm, in Room Leo 2, Mustafa Oezkoek, Global Product Manager Panel and Pattern Plating at Atotech Group, will present \u201cEnhancing productivity for IC-substrate manufacturing by using a novel copper electrolyte for Semi Additive Plating (SAP)\u201d.<\/p>\n
In his presentation, Mustafa will introduce a new SAP copper electrolyte which allows for higher current densities while still keeping very good copper thickness within unit distribution (WUD) results.<\/p>\n
\u201cWhen operating with lines and spaces (L\/S) of 10\/10 \u03bcm and less, copper thickness variation is one of the critical parameters, which have to be controlled within a tight range in order to avoid reliability problems in assembly or during the lifetime. Another important parameter is the current density used for the copper plating process. The current density is important for the productivity but also impacts the surface thickness distribution which is not beneficial for the quality of the product,\u201d states Mustafa. \u201cWe have developed an electrolyte which overcomes this conflict of productivity and copper thickness variation. Besides several beneficial parameters, its main benefit is its capability to operate at > 3 A\/dm\u00b2, which brings an improvement of the productivity by a factor of almost two.\u201d<\/p>\n
Visitors to the EPTC are welcome to join the presentation and discuss this and further market-leading new developments with Mustafa following the presentation. <\/p>\n
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Atotech will introduce a new SAP copper electrolyte which allows for higher current densities while still keeping very good copper thickness within unit distribution (WUD) results.<\/p>\n","protected":false},"author":4,"featured_media":43838,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"","iawp_total_views":1,"footnotes":""},"categories":[113],"tags":[],"class_list":["post-45784","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press-releases-cn"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts\/45784","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/users\/4"}],"replies":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/comments?post=45784"}],"version-history":[{"count":0,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts\/45784\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/media\/43838"}],"wp:attachment":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/media?parent=45784"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/categories?post=45784"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/tags?post=45784"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}