[et_pb_section bb_built=”1″ admin_label=”section” disabled_on=”off|off|off” disabled=”off”][et_pb_row background_position=”top_left” background_repeat=”repeat” background_size=”initial”][et_pb_column type=”1_3″][et_pb_image src=”https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/10\/MultiPlate-PLP.jpg” sticky=”off” border_style=”solid” _builder_version=”3.2.2″ \/][et_pb_text _builder_version=”3.2.2″ border_style=”solid”]<\/p>\n
MultiPlate\u00ae PLP, Atotech\u2019s revolutionary new tool for FO-PLP<\/p>\n
[\/et_pb_text][\/et_pb_column][et_pb_column type=”2_3″][et_pb_text admin_label=”Reducing manufacturing costs on Fan-Out Panel-Level Packaging (FO-PLP)” text_font_size=”18″ border_style=”solid” _builder_version=”3.2.2″]<\/p>\n
Berlin, 8 October, 2018:<\/strong> \u201cUpscaling panel size for copper plating on FO-PLP applications to reduce manufacturing cost\u201d will be the topic of Atotech\u2019s presentation at this year\u2019s iMAPS conference, held in Pasadena, USA, from October 8 to 11, 2018.<\/p>\n Atotech\u2019s presentation is part of Session TP2 on advanced fan-out and will be held by Christian Ohde, Global Application Manager for Panel and Pattern Plating and Dirk Ruess, Sales Development Manager for Electronics Equipment, on Tuesday, October 9, 2018, from 2:00 \u2013 2:25 pm.<\/p>\n \u201cSince the successful implementation of Fan-Out Wafer-Level Packaging (FO-WLP) in the production of the iPhone 7 the industry is interested to increase the through-put and lower the total cost of ownership by moving from round wafer to panel format,\u201d explains Christian Ohde. He continues \u201cwith Atotech\u2019s MultiPlate\u00ae, a revolutionary new plating tool, the plating requirements for both wafer- and panel level packaging are met.\u201d<\/p>\n The presentation will discuss the developments in FO-PLP and explain the current capability for copper distribution over panels for various panel formats (370 \u00d7 470 mm\u00b2 up to 600 \u00d7 600 mm\u00b2). It will also introduce Atotech\u2019s newly developed electrolytes for high-speed copper deposition in RDL plating – both with and without microvias and tall pillar plating (PoP design).<\/p>\n \u201cRecently obtained process results show that FO-PLP has the potential to be not only a strong competition approach to FO-WLP, but seriously challenge the status quo in the coming years. High speed copper deposition enabled by the combination of new electrolytes and adapted plating equipment technology will be the answer of the challenges the industry currently faces,\u201d adds Dirk.<\/p>\n The company will also present two topics at the poster session in the foyer on Thursday, October 11, from 11:45 am to 1:15 pm:<\/p>\n Atotech invites all iMAPS conference visitors to stop by and join their presentations on October 9 and 11. The Atotech team is also looking forward to discuss any other themes, trends and recent developments.<\/p>\n [\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section]<\/p>\n","protected":false},"excerpt":{"rendered":" Atotech specialists will speak at the iMAPS on several current topics such as recent developments and solutions for Panel-Level Packaging.<\/p>\n","protected":false},"author":4,"featured_media":43601,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"","iawp_total_views":1,"footnotes":""},"categories":[113],"tags":[],"class_list":["post-45800","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-press-releases-cn"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts\/45800","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/users\/4"}],"replies":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/comments?post=45800"}],"version-history":[{"count":0,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts\/45800\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/media\/43601"}],"wp:attachment":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/media?parent=45800"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/categories?post=45800"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/tags?post=45800"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}\n