{"id":45893,"date":"2017-10-12T11:19:11","date_gmt":"2017-10-12T11:19:11","guid":{"rendered":"https:\/\/www.atotech.com\/tpca-2017-taipei-taiwan\/"},"modified":"2019-05-16T12:45:41","modified_gmt":"2019-05-16T10:45:41","slug":"tpca-2017-taipei-taiwan","status":"publish","type":"post","link":"https:\/\/www.atotech.com\/cn\/tpca-2017-taipei-taiwan\/","title":{"rendered":"TPCA 2017 || Taipei, Taiwan"},"content":{"rendered":"

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Conference:<\/strong><\/span> TPCA 2017<\/p>\n

Date:<\/strong><\/span> October 25 \u2013 27, 2017<\/p>\n

Venue:<\/strong><\/span> Taipei Nangang Exhibition Center, Taipei, Taiwan<\/p>\n

Atotech booth no.:<\/strong><\/span> K818<\/p>\n

WE ARE READY AND EXCITED. ARE YOU?
\nAtotech is looking forward to participate in the 2017 TPCA Show and IMPACT conference in Taipei, Taiwan. Come by and learn everything about our latest capabilities for building the next generation HDI PCB (substrate-like product) using (a)mSAP technology or solutions for high-end flex and rigid-flex OLED PCBs. In addition, we present our solutions for future mobile and automotive chip-sets using FOWLP and FOPLP.<\/p>\n

At this years IMPACT conference we will present a series of different topics, from metal oxide adhesion and wet chemical metallization on glass to through hole copper filling for the next generation packaging. We also touch the topic of Wafer Level Packaging moving towards Panel Level Packaging and outline the pros and cons, as well as demonstrate Atotech\u2018s role in this movement and solutions.<\/p>\n

Additionally, we will launch 3 new products to the market during the NPI seminar:
\n#1 InPro\u00ae – New VCP additive generation for best performance in the market
\n#2 PallaBond\u00ae – New direct pure EPAG for soldering, gold- and copper-wire bonding
\n#3 Innolyte\u00ae – New electrolytic copper plating solution for panel level packaging applications\n<\/p>\n

For more information, please visit: www.tpcashow.com\/en<\/a><\/p>\n

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Atotech presents next generation HDI technologies using (advanced) modified semi-additive processing (amSAP\/mSAP) for smartphone applications at the TPCA Show 2017 in Taipei.<\/p>\n","protected":false},"author":4,"featured_media":42190,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"","iawp_total_views":1,"footnotes":""},"categories":[108],"tags":[],"class_list":["post-45893","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-tradeshows-events-cn"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts\/45893","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/users\/4"}],"replies":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/comments?post=45893"}],"version-history":[{"count":0,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/posts\/45893\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/media\/42190"}],"wp:attachment":[{"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/media?parent=45893"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/categories?post=45893"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.atotech.com\/cn\/wp-json\/wp\/v2\/tags?post=45893"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}