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Atotech to exhibit at SEMICON China 2017<\/strong><\/p>\n The company will showcase solutions aimed to address next generation packaging challenges<\/p>\n BERLIN, 23 February, 2017: MultiPlate\u00ae for Semiconductor Advanced Packaging<\/strong> Xenolyte\u00ae Zincate CFA2<\/strong> Spherolyte\u00ae RDL\/Pillar 3<\/strong> Delegates and prospect customers can also learn more about Atotech\u2019s plating solutions for fan-out packaging, as described in a recently published article \u201cFan-out packaging: a key enabler for optimal performance in mobile devices<\/a>,\u201d in the January\/ February edition of Chip Scale Review.<\/p>\n
\nAtotech, the global leader in specialty plating chemicals, equipment and services announced that it will exhibit at Semicon China 2017 to be held in Shanghai from 14th to 17th of March. Delegates at the show will get a chance to meet experts from Atotech at booth no. 5363 to discuss some of their leading and recently launched products. The company will present its key solutions designed to address the next generation packaging solution, namely MultiPlate\u00ae, Xenolyte\u00ae Zincate CFA2 pretreatment process and Spherolyte\u00ae RDL \/ Pillar 3 process. Semicon is one of the most influential and premier gathering of semiconductor professionals making it an essential platform for companies like Atotech to showcase their solutions there.<\/p>\n
\nMultiPlate\u00ae is a versatile and innovative ECD packaging tool, designed to tackle current and future challenges for optimal performance in advanced packaging applications. Built for flexible R&D and high end application-specific production, MultiPlate\u00ae can be customized for single and double side plating on pillar, redistribution layer, and termination structures.<\/p>\n
\nXenolyte\u00ae Zincate CFA2 is Atotechs universal pretreatment process for all types of Al and Al alloy wafers. The pretreatment removes the oxide layer of Al and replaces it with a zinc layer of several nanometers. Following pretreatment, the zinc layer may be plated with electroless nickel for further metallization.<\/p>\n
\nUnlike standard conformal copper pillar plating processes, the Spherolyte\u00ae Cu RDL\/Pillar 3 process enables flat and recess free pillar plating, even when plating on top of \u03bc-vias. The process deposits pure copper, which leads to lower void formation at the intermetallic phase after high temperature storage. It also enables the elimination of the nickel plating step, which is typically used as diffusion barrier to prohibit migration and voiding.<\/p>\n