  {"id":51269,"date":"2019-12-10T10:05:16","date_gmt":"2019-12-10T09:05:16","guid":{"rendered":"https:\/\/www.atotech.com\/?page_id=51269"},"modified":"2025-07-03T11:10:30","modified_gmt":"2025-07-03T09:10:30","slug":"electrolytic-plating","status":"publish","type":"page","link":"https:\/\/www.atotech.com\/de\/produkte\/electronics\/electrolytic-plating\/","title":{"rendered":"Electrolytic plating"},"content":{"rendered":"<p>[et_pb_section fb_built=&#8220;1&#8243; fullwidth=&#8220;on&#8220; custom_padding_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;section&#8220; module_class=&#8220;Top&#8220; _builder_version=&#8220;4.16&#8243; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; transparent_background=&#8220;off&#8220; padding_mobile=&#8220;off&#8220; make_fullwidth=&#8220;off&#8220; use_custom_width=&#8220;off&#8220; width_unit=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_fullwidth_slider show_arrows=&#8220;off&#8220; show_pagination=&#8220;off&#8220; admin_label=&#8220;Hero Slider Small&#8220; module_id=&#8220;Top&#8220; module_class=&#8220;atotech-smallslider&#8220; _builder_version=&#8220;4.16&#8243; background_position=&#8220;top_left&#8220; custom_padding=&#8220;100px||100px|&#8220; custom_padding_tablet=&#8220;|||&#8220; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220; button_text_size__hover_enabled=&#8220;off&#8220; button_text_size__hover=&#8220;null&#8220; button_one_text_size__hover_enabled=&#8220;off&#8220; button_one_text_size__hover=&#8220;null&#8220; button_two_text_size__hover_enabled=&#8220;off&#8220; button_two_text_size__hover=&#8220;null&#8220; button_text_color__hover_enabled=&#8220;off&#8220; button_text_color__hover=&#8220;null&#8220; button_one_text_color__hover_enabled=&#8220;off&#8220; button_one_text_color__hover=&#8220;null&#8220; button_two_text_color__hover_enabled=&#8220;off&#8220; button_two_text_color__hover=&#8220;null&#8220; button_border_width__hover_enabled=&#8220;off&#8220; button_border_width__hover=&#8220;null&#8220; button_one_border_width__hover_enabled=&#8220;off&#8220; button_one_border_width__hover=&#8220;null&#8220; button_two_border_width__hover_enabled=&#8220;off&#8220; button_two_border_width__hover=&#8220;null&#8220; button_border_color__hover_enabled=&#8220;off&#8220; button_border_color__hover=&#8220;null&#8220; button_one_border_color__hover_enabled=&#8220;off&#8220; button_one_border_color__hover=&#8220;null&#8220; button_two_border_color__hover_enabled=&#8220;off&#8220; button_two_border_color__hover=&#8220;null&#8220; button_border_radius__hover_enabled=&#8220;on&#8220; button_border_radius__hover=&#8220;3&#8243; button_one_border_radius__hover_enabled=&#8220;off&#8220; button_one_border_radius__hover=&#8220;null&#8220; button_two_border_radius__hover_enabled=&#8220;off&#8220; button_two_border_radius__hover=&#8220;null&#8220; button_letter_spacing__hover_enabled=&#8220;on&#8220; button_letter_spacing__hover=&#8220;0&#8243; button_one_letter_spacing__hover_enabled=&#8220;off&#8220; button_one_letter_spacing__hover=&#8220;null&#8220; button_two_letter_spacing__hover_enabled=&#8220;off&#8220; button_two_letter_spacing__hover=&#8220;null&#8220; button_bg_color__hover_enabled=&#8220;off&#8220; button_bg_color__hover=&#8220;null&#8220; button_one_bg_color__hover_enabled=&#8220;off&#8220; button_one_bg_color__hover=&#8220;null&#8220; button_two_bg_color__hover_enabled=&#8220;off&#8220; button_two_bg_color__hover=&#8220;null&#8220;][et_pb_slide use_bg_overlay=&#8220;off&#8220; use_text_overlay=&#8220;off&#8220; _builder_version=&#8220;4.16&#8243; background_color=&#8220;#ffffff&#8220; background_image=&#8220;\/wp-content\/uploads\/2016\/02\/pp-top.jpg&#8220; background_position=&#8220;top_center&#8220; button_on_hover=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; sticky_transition=&#8220;on&#8220;]<\/p>\n<div class=\"slidercontent-left\">\n<h3>F\u00fchrende galvanische Kupferb\u00e4der f\u00fcr Panel- und Pattern Plating und f\u00fcr das F\u00fcllen von Sackloch- und<\/h3>\n<h3> Durchgangsbohrungen sowie Vorbehandlungen und galvanische B\u00e4der f\u00fcr Endoberfl\u00e4chen<\/h3>\n<p><a class=\"et_pb_more_button et_pb_button\" href=\"#ProductPortfolio\">Unser Produktportfolio<\/a><\/p>\n<\/div>\n<p>[\/et_pb_slide][\/et_pb_fullwidth_slider][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;section&#8220; module_class=&#8220;breadcrumb-container&#8220; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;0|||&#8220; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; transparent_background=&#8220;off&#8220; 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background_repeat=&#8220;repeat&#8220; module_alignment=&#8220;left&#8220; use_border_color=&#8220;off&#8220; border_color=&#8220;#ffffff&#8220; border_style=&#8220;solid&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>\n<nav class=\"atotech-breadcrumb\"><a href=\"https:\/\/www.atotech.com\/de\/\">Home<\/a> <span class=\"bc-divider\"><i class=\"icon-arrow\"><\/i><\/span> <span class=\"current-page\">Seite<\/span><\/nav><br \/>\n[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;section&#8220; module_class=&#8220;atotech-detailheader&#8220; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;0|||&#8220; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; transparent_background=&#8220;off&#8220; padding_mobile=&#8220;off&#8220; make_fullwidth=&#8220;off&#8220; use_custom_width=&#8220;off&#8220; width_unit=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row admin_label=&#8220;row&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;4_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Electrolytic plating&#8220; _builder_version=&#8220;4.24.2&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; text_orientation=&#8220;center&#8220; module_alignment=&#8220;center&#8220; custom_margin=&#8220;20|||&#8220; z_index_tablet=&#8220;500&#8243; use_border_color=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h1>Elektrolytische Metallabscheidung<\/h1>\n<h2>Ganzheitliches System von nasschemischer Verfahrens- und Anlagentechnik f\u00fcr Package-Substrate und Leiterplatten<\/h2>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8220;1_2,1_2&#8243; admin_label=&#8220;row&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text module_class=&#8220;same-height list-line-style&#8220; _builder_version=&#8220;4.24.2&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h4>Fakten im \u00dcberblick<\/h4>\n<ul class=\"facts\">\n<li>Elektrolytische Metallabscheidung f\u00fcr h\u00f6chste Anforderungen an Zuverl\u00e4ssigkeit und Produktivit\u00e4t<\/li>\n<li>L\u00f6sungen f\u00fcr verschiedene Anlagentypen: Uniplate\u00ae IP2, V-Plate\u00ae und andere vertikale Durchlaufanlagen (VCP), Vertikal-Gestellanlagen<\/li>\n<li>Marktf\u00fchrende Uniplate\u00ae IP2-Anlagen f\u00fcr horizontale Durchlaufproduktion<\/li>\n<\/ul>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text module_class=&#8220;same-height list-line-style&#8220; _builder_version=&#8220;4.24.2&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h4>Anwendungen<\/h4>\n<ul>\n<li>Gleichm\u00e4\u00dfige Metallabscheidung<\/li>\n<li>F\u00fcllen von Sacklochbohrungen (BMV)<\/li>\n<li>F\u00fcllen von Durchgangsbohrungen (TH)<\/li>\n<li>Vorbehandlung<\/li>\n<li>Metallresist, galvanische B\u00e4der f\u00fcr Endoberfl\u00e4chen<\/li>\n<\/ul>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; fullwidth=&#8220;on&#8220; custom_padding_last_edited=&#8220;on|desktop&#8220; disabled_on=&#8220;on|on|on&#8220; admin_label=&#8220;section&#8220; _builder_version=&#8220;4.16&#8243; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; disabled=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_fullwidth_menu menu_id=&#8220;35&#8243; submenu_direction=&#8220;downwards&#8220; fullwidth_menu=&#8220;off&#8220; module_id=&#8220;atotech-sticky-nav&#8220; _builder_version=&#8220;4.16&#8243; background_color=&#8220;#5992d6&#8243; text_orientation=&#8220;center&#8220; background_layout=&#8220;dark&#8220; global_colors_info=&#8220;{}&#8220;][\/et_pb_fullwidth_menu][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;section&#8220; module_id=&#8220;ProductPortfolio&#8220; _builder_version=&#8220;4.16&#8243; background_color=&#8220;#ffffff&#8220; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; transparent_background=&#8220;off&#8220; padding_mobile=&#8220;off&#8220; make_fullwidth=&#8220;off&#8220; use_custom_width=&#8220;off&#8220; width_unit=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row padding_mobile=&#8220;off&#8220; column_padding_mobile=&#8220;on&#8220; admin_label=&#8220;row&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; make_fullwidth=&#8220;off&#8220; use_custom_width=&#8220;off&#8220; width_unit=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;4_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Product portfolio&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; module_alignment=&#8220;center&#8220; z_index_tablet=&#8220;500&#8243; use_border_color=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2>Produkt\u00fcbersicht<\/h2>\n<p>[\/et_pb_text][et_pb_accordion _builder_version=&#8220;4.24.2&#8243; body_font_size=&#8220;17&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;][et_pb_accordion_item title=&#8220;Gleichm\u00e4\u00dfige Kupferabscheidung&#8220; open=&#8220;on&#8220; _builder_version=&#8220;4.24.2&#8243; global_colors_info=&#8220;{}&#8220;]<div class='one_fourth'>\n\t\t\t\t\t<div id=\"attachment_4351\" style=\"width: 260px\" class=\"wp-caption alignleft\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-4351\" class=\"wp-image-4351\" src=\"\/wp-content\/uploads\/2016\/05\/el-pp-conformal-copper-plating-147x300.jpg\" alt=\"Atotech\" width=\"250\" height=\"508\" srcset=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2016\/05\/el-pp-conformal-copper-plating-147x300.jpg 147w, https:\/\/www.atotech.com\/wp-content\/uploads\/2016\/05\/el-pp-conformal-copper-plating.jpg 383w\" sizes=\"(max-width: 250px) 100vw, 250px\" \/><p id=\"caption-attachment-4351\" class=\"wp-caption-text\">Panel 2.4 mm thickness incl. flash copper, hole diameter 0.2 mm, aspect ratio: 12:1, throwing power: &gt; 85%<\/p><\/div>\n\t\t\t\t<\/div><div class='three_fourth et_column_last'>\n\t\t\t\t\t<ul>\n<li>Gleichm\u00e4\u00dfige Metallabscheidung f\u00fcr die Massenproduktion mit <strong>Uniplate\u00ae InPulse 2-Anlagen<\/strong>: Durch die gute Metallstreuung in Sacklochbohrungen kann mit Inpulse\u00ae 2HFU eine zuverl\u00e4ssige Metallisierung selbst bei Bohrungsdefekten und wedge voids erfolgen. Das Verfahren ist bei der mSAP-Technologie die ideale L\u00f6sung f\u00fcr zuverl\u00e4ssiges Flash Plating. Inpulse\u00ae 2HT gew\u00e4hrleistet selbst in Bereichen hoher und niedriger Bohrlochdichte ein H\u00f6chstma\u00df an Gleichm\u00e4\u00dfigkeit der Metallisierung in Durchgangsbohrungen und auf der Oberfl\u00e4che.<\/li>\n<li>Die neueste Version der Atotech <strong>Cupracid\u00ae TP<\/strong> Serie: <strong>Cupracid\u00ae TP5<\/strong>. Hierbei handelt es sich um ein galvanisches Kupferbad f\u00fcr konventionelle Vertikal-Gestellanlagen mit Gleichstrom mit l\u00f6slichen Anoden. Es bietet eine hervorragende Streuf\u00e4higkeit in Durchgangsbohrungen und BMVs bei hohen Stromdichten. Dar\u00fcber hinaus bietet Cupracid\u00ae TP5  bietet hervorragende Zuverl\u00e4ssigkeitsergebnisse und eignet sich daher z. B. f\u00fcr die anspruchsvolle Automobilproduktion.<\/li>\n<li><strong>Cupracid\u00ae AC5<\/strong> ist unser Verfahren der n\u00e4chsten Generation f\u00fcr die konforme Kupferbeschichtung mit l\u00f6slichen Anoden. Es bietet gute Streuf\u00e4higkeit sowohl in BMVs als auch in Durchgangsbohrungen bei hohen Stromdichten. Es ist mit einer breiten Palette von Metallisierungsprozessen auf dem Markt kompatibel und eignet sich ideal f\u00fcr die Automobilproduktion. Cupracid\u00ae AC5 ist mit einer Vielzahl von vertikalen Durchlaufanlagen (VCP) mit Elektrolytbewegung durch Eduktoren sowie in Vertikal-Gestellanlagen mit Lufteinblasung einsetzbar.<\/li>\n<li><strong>Cuprapulse\u00ae XP8<\/strong> f\u00fcr Vertikal-Anlagen mit l\u00f6slichen Anoden ist der Nachfolger unserer bekannten Reverse Pulse Plating-L\u00f6sung Cuprapulse\u00ae XP7 f\u00fcr die gleichm\u00e4\u00dfige Kupferabscheidung bei hohem Aspektverh\u00e4ltnis. Die Gleichstromtechnologie kommt nicht einmal ann\u00e4hernd an die mit Cuprapulse\u00ae XP8 erzielte Streuf\u00e4higkeit heran. Die hohe Stromdichte beim Reverse Pulse Plating erm\u00f6glicht eine h\u00f6here Produktivit\u00e4t bei gleichzeitiger Qualit\u00e4tsverbesserung wie bessere Oberfl\u00e4chenverteilung und Leiterbahnform. Cuprapulse\u00ae XP8 bietet eine bessere Prozessstabilit\u00e4t, ein gr\u00f6\u00dferes Arbeitsfenster und ein verbessertes Oberfl\u00e4chenbild.<\/li>\n<li><strong>Cuprapulse\u00ae IN<\/strong> ist unsere Antwort auf die steigende Marktnachfrage nach vertikalem Reverse Pulse Plating mit unl\u00f6slichen Anoden in VCP- und Vertikal-Gestellanlagen. Es bietet ein gleichm\u00e4\u00dfigeres Kupferaussehen im Vergleich zu Standard-Reverse Pulse Plating-Prozessen mit l\u00f6slichen Anoden. Es kann bei turbulenten Str\u00f6mungsbedingungen betrieben werden, ohne da\u00df es zu einem Aus\u00f6len oder dem sogenannten \u201etwo-tone effect\u201c kommt. Die Reverse Pulse Plating erm\u00f6glicht eine \u00fcberragende Streuf\u00e4higkeit bei k\u00fcrzester Beschichtungszeit f\u00fcr einen hohen Durchsatz in Ihrer Beschichtungsanlage.<\/li>\n<li>Speziell f\u00fcr die Anforderungen des Flex- und Starrflex-Marktes haben wir <strong>InPro\u00ae FLEX2 \/ Cupracid\u00ae FLEX2<\/strong> entwickelt. Beide Verfahren bieten eine gleichm\u00e4\u00dfige Kupferabscheidung bei hohen Stromdichten und bieten eine hervorragende Streuf\u00e4higkeit in Durchgangsbohrungen. Die mit beiden Verfahren abgeschiedenen Schichten haben ein ausgezeichnetes Kristallgef\u00fcge, eine hohe Duktilit\u00e4t und eine sehr gute Biegef\u00e4higkeit, um die h\u00f6chsten Anforderungen flexibler Leiterplatten zu erf\u00fcllen. InPro\u00ae FLEX2 ist f\u00fcr die Verwendung mit unl\u00f6slichen Anoden vorgesehen, Cupracid\u00ae FLEX2 arbeitet mit l\u00f6slichen Anoden.<\/li>\n<\/ul>\n\t\t\t\t<\/div><div class='clear'><\/div>[\/et_pb_accordion_item][et_pb_accordion_item title=&#8220;F\u00fcllen von Sacklochbohrungen (BMV) mit Kupfer &#8220; _builder_version=&#8220;4.24.2&#8243; global_colors_info=&#8220;{}&#8220; open=&#8220;off&#8220;]<div class='one_fourth'>\n\t\t\t\t\t<div id=\"attachment_13476\" style=\"width: 224px\" class=\"wp-caption alignnone\"><a href=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2016\/02\/panel-pattern-plating-inpulse-2hf-and-msap.jpg\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-13476\" class=\"wp-image-13476 size-medium\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2016\/02\/panel-pattern-plating-inpulse-2hf-and-msap-214x300.jpg\" alt=\"Atotech\" width=\"214\" height=\"300\"><\/a><p id=\"caption-attachment-13476\" class=\"wp-caption-text\">BMV filling in panel and pattern mode (Inpulse<sup>\u00ae<\/sup> 2HF and Inpulse<sup>\u00ae<\/sup> 2MSAP)<\/p><\/div>\n\t\t\t\t<\/div><div class='three_fourth et_column_last'>\n\t\t\t\t\t<ul>\n<li>F\u00fcllen von Sacklochbohrungen in Horizontal-Anlagen: <strong>Inpulse\u00ae 2HF9<\/strong> bietet ein hervorragendes BMV-F\u00fclllergebnis (Superfilling\u00ae). Mit dem Superfilling\u00ae-Prozess werden sehr gute F\u00fcllergebnisse bei minimaler Kupferabscheidung auf der Oberfl\u00e4che erzielt. Dadurch eignet sich der Atotech Superfilling\u00ae-Prozess, bestehend aus der Uniplate\u00ae InPulse 2-Anlage in Kombination mit der Fe-Redox-Kupfererg\u00e4nzung und dem Inpulse\u00ae 2HF9-Kupferbad, ideal f\u00fcr die High-End-Massenproduktion von HDI-Leiterplatten und wird bereits vielfach daf\u00fcr eingesetzt.<\/li>\n<li>F\u00fcllen von Sacklochbohrungen in Vertikal-Anlagen: <strong>InPro\u00ae MVF<\/strong> und <strong>InPro\u00ae MVF2<\/strong> sind Atotech\u2019s Kupferelektrolyte die in VCP-Anlagen zum F\u00fcllen von Sacklochbohrungen von aktuellen und zuk\u00fcnftigen HDI-Leiterplattendesigns eingesetzt werden. Beide Kupferb\u00e4der sind f\u00fcr den Gebrauch von unl\u00f6slichen Anoden mit Gleichstrom konzipiert und haben bei geringer Schichtdicke auf der Oberfl\u00e4che eine hervorragende Filling-Performance bei Sacklochbohrungen ohne \u201eDome-Plating\u201c.\n<\/li>\n<li>Das in der Massenproduktion bew\u00e4hrte <strong>InPro\u00ae THF<\/strong> wird in VCP-Anlagen mit unl\u00f6slichen Anoden zum F\u00fcllen von Durchgangsbohrungen sowie auch zum F\u00fcllen von Sacklochbohrungen in Panel oder Pattern Plating bei hohen Stromdichten f\u00fcr mSAP-Anwendungen eingesetzt. Es ist die Referenz f\u00fcr mSAP-Anwendungen. Die n\u00e4chste Generation InPro\u00ae THF2 bietet eine verbesserte Filling-Performance, bessere Oberfl\u00e4chenverteilung und Duktilit\u00e4t, welche besonders wichtig bei der amSAP-Fertigung ist.<\/li>\n<li><strong>InPro\u00ae SAP3<\/strong> ist unser in der Massenproduktion bew\u00e4hrtes Verfahren f\u00fcr das F\u00fcllen von Sacklochbohrungen mit Kupfer bei IC Substraten in vertikalen Durchlaufanlagen (VCP) mit unl\u00f6slichen Anoden. Dieser Proze\u00df erm\u00f6glicht eine exzellente Oberfl\u00e4chenverteilung innerhalb eines Fertigungsnutzens, dadurch kann die Produktivit\u00e4t durch h\u00f6herer Stromdichten erh\u00f6ht werden. Der Elektrolyt hat ein gro\u00dfes Arbeitsfenster, in dem eine gute Filling-Performance erzielt wird und gew\u00e4hrleistet zuverl\u00e4ssig hohe Fertigungsresultate bei Fine Line-Anwendungen. <strong>InPro\u00ae SAP6<\/strong> ist unser Proze\u00df der n\u00e4chsten Generation. Er kann mit noch h\u00f6heren Stromdichten betrieben werden, um die Produktivit\u00e4t zu steigern. InPro\u00ae SAP6 bietet im Vergleich zur POR-Chemie die beste Oberfl\u00e4chenverteilung innerhalb eines Fertigungsnutzens auf dem Markt f\u00fcr anspruchsvolle IC-Schichten und eine hervorragendes Oberfl\u00e4chenbild.<\/li>\n<li>Das F\u00fcllen von Sachlochbohrungen bei flexiblen Leiterplatten, speziell wenn RA-Kupferfolien verwendet werden, ist nicht einfach. In diesem Fall ist es schwierig ein gleichm\u00e4\u00dfig gutes F\u00fcllverhalten bei einer gleichzeitig gl\u00e4nzenden Kupferschicht abzuscheiden. Grund daf\u00fcr ist die typische Kristallstruktur des RA-Kupfers. <strong>InPro\u00ae FLEXFILL<\/strong> bietet eine gl\u00e4nzende Kupferabscheidung sowie ein zuverl\u00e4ssiges F\u00fcllverhalten selbst bei \u201ehalf etched\u201c RA-Kupferfolien und erf\u00fcllt dadurch die Industriestandards f\u00fcr Zuverl\u00e4ssigkeit von flexiblen Leiterplatten. <strong>InPro\u00ae FLEXFILL<\/strong>  kann sowohl in vertikalen Durchlaufanlagen (VCP), Reel-to-Reel-Durchlaufanlagen sowie in vertikalen Gestellanlagen mit inerten Anoden und Elektrolytbewegung mittels \u201esparger\u201c eingesetzt werden.<\/li>\n<\/ul>\n\t\t\t\t<\/div><div class='clear'><\/div>[\/et_pb_accordion_item][et_pb_accordion_item title=&#8220;F\u00fcllen von Kupferdurchgangsbohrungen&#8220; _builder_version=&#8220;4.24.2&#8243; global_colors_info=&#8220;{}&#8220; open=&#8220;off&#8220;]<div class='one_fourth'>\n\t\t\t\t\t<div id=\"attachment_4387\" style=\"width: 248px\" class=\"wp-caption alignleft\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-4387\" class=\"wp-image-4387 size-medium\" src=\"\/wp-content\/uploads\/2016\/05\/panel-pattern-plating-inclusion-free-through-hole-238x300.jpg\" alt=\"Atotech\" width=\"238\" height=\"300\" srcset=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2016\/05\/panel-pattern-plating-inclusion-free-through-hole-238x300.jpg 238w, https:\/\/www.atotech.com\/wp-content\/uploads\/2016\/05\/panel-pattern-plating-inclusion-free-through-hole.jpg 250w\" sizes=\"(max-width: 238px) 100vw, 238px\" \/><p id=\"caption-attachment-4387\" class=\"wp-caption-text\">Laser drilled , inclusion-free through hole: Diameter 100 \u00b5m, panel thickness 0.2mm, plated Cu 15 \u00b5m<\/p><\/div>\n\t\t\t\t<\/div><div class='three_fourth et_column_last'>\n\t\t\t\t\t<ul>\n<li>In der Kombination Uniplate\u00ae InPulse 2-Anlage mit <strong>Inpulse\u00ae 2THF2<\/strong> ist dieses System hervorragend zum F\u00fcllen von Durchgangsbohrungen geeignet, insbesondere f\u00fcr Innenkerne mit weniger als 5 \u00b5m Kupferkaschierung. Das System Inpulse\u00ae 2THF2 wird mit Reverse-Pulse-Plating betrieben und f\u00fcllt die Durchgangsbohrungen zuverl\u00e4ssig und ohne Einschl\u00fcsse (inclusion-free). Dabei wird unser patentierter X-Plating-Prozess mit dem Superfilling\u00ae-Prozess kombiniert, um eine m\u00f6glichst geringe Schichtdicke auf der Oberfl\u00e4che abzuscheiden.<\/li>\n<li><strong>InPro\u00ae THF<\/strong> wird weltweit in VCP-Anlagen mit Gleichstrom zum F\u00fcllen von lasergebohrten Durchgangsbohrungen (LTH) bei der Massenproduktion von IC-Substraten eingesetzt. <strong>InpPro\u00ae 2THF2<\/strong> ist die n\u00e4chste Elektrolyte-Generation und bietet eine verbesserte Filling-Performance und Oberfl\u00e4chenverteilung. Beide Elektrolyte k\u00f6nnen auch zum F\u00fcllen von BMVs in Pattern Plating mit hohen Stromdichten f\u00fcr die (a)mSAP-Produktion verwendet werden.<\/li>\n<\/ul>\n\t\t\t\t<\/div><div class='clear'><\/div>[\/et_pb_accordion_item][et_pb_accordion_item title=&#8220;Metall-Resist-Beschichtung (Zinn)&#8220; _builder_version=&#8220;4.24.2&#8243; _module_preset=&#8220;default&#8220; global_colors_info=&#8220;{}&#8220; open=&#8220;off&#8220;]<\/p>\n<div class='one_fourth'>\n\t\t\t\t\t<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-80737 size-medium\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2022\/10\/111M0439-300x225.jpg\" alt=\"Atotech\" width=\"300\" height=\"225\" \/><\/p>\n\t\t\t\t<\/div><div class='three_fourth et_column_last'>\n\t\t\t\t\t<ul>\n<li><strong>Sulfotech\u00ae LST<\/strong> ist unser Metallresist-Verfahren, das eine au\u00dfergew\u00f6hnliche Verteilung der beschichteten Oberfl\u00e4che aufweist. Der Elektrolyt kann kosteng\u00fcnstig mit Schwefels\u00e4ure gefahren werden, es gibt auch eine MSA-Variante. Er scheidet feink\u00f6rniges, dichtes Zinn f\u00fcr optimale \u00c4tzbest\u00e4ndigkeit ab. Der Elektrolyt weist eine niedrige Oberfl\u00e4chenspannung auf und erzielt gute Ergebnisse bei BMVs und hohen Aspektverh\u00e4ltnissen. Dar\u00fcber hinaus entsprechen die Prozessadditive den EU-Umweltvorschriften und sind frei von NPE und Methanol.<\/li>\n<li><strong>Tinpulse\u00ae SC <\/strong>: Erm\u00f6glicht eine hohe Produktivit\u00e4t durch Abscheidung im Pulseverfahren (3-4x h\u00f6her im Vergleich zum Standard-Gleichstromverfahren) f\u00fcr Metallresistanwendungen. Der Proze\u00df bietet eine hervorragende Streuff\u00e4higkeit in BMVs und Durchgangsbohrungen mit hohem Aspektenverh\u00e4ltnis (AR bis zu 20:1) und der Einsatz des Pulseverfahrens verbessert die Kristallstruktur f\u00fcr eine optimale feink\u00f6rnige, dichte Zinnabscheidung. Das Pulseverfahren bietet dar\u00fcber hinaus eine hervorragende Oberfl\u00e4chenverteilung, was zu einer Kostenreduzierung von ca. 30 % beim Anodenmaterial f\u00fchrt und die Gefahr von Kurzschl\u00fcssen und sogenanntes \u201eMushrooming\u201c verringert.<\/li>\n<\/ul>\n\t\t\t\t<\/div><div class='clear'><\/div><\/p>\n<p>[\/et_pb_accordion_item][et_pb_accordion_item title=&#8220;Galvanische Endoberfl\u00e4chen&#8220; _builder_version=&#8220;4.24.2&#8243; global_colors_info=&#8220;{}&#8220; open=&#8220;off&#8220;]<div class='one_fourth'>\n\t\t\t\t\t<div id=\"attachment_4388\" style=\"width: 260px\" class=\"wp-caption alignleft\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-4388\" class=\"wp-image-4388 size-full\" src=\"\/wp-content\/uploads\/2016\/05\/panel-pattern-plating-solderfill.jpg\" alt=\"Atotech\" width=\"250\" height=\"134\"><p id=\"caption-attachment-4388\" class=\"wp-caption-text\">SolderFill for filling of smallest SRO\u2019s<\/p><\/div>\n\t\t\t\t<\/div> <div class='three_fourth et_column_last'>\n\t\t\t\t\t<ul>\n<li><strong>Nikotron<sup>\u00ae<\/sup><\/strong>: Weiche, duktile und spannungsarme Nickelschichten. Eigenspannung und H\u00e4rtegrad sind einstellbar.<\/li>\n<li><strong>Aurotron<sup>\u00ae<\/sup><\/strong>: Galvanische Goldb\u00e4der f\u00fcr Drahtbonden und L\u00f6ten sowie Hartgoldanwendungen.<\/li>\n<li><strong>Pallatron<\/strong>: Galvanische Palladiumabscheidung f\u00fcr hohe Zuverl\u00e4ssigkeit und reduzierte Prozesskosten bei Ni\/Pd\/Au-Anwendungen.<\/li>\n<li><strong>SolderFill<sup>\u00ae<\/sup><\/strong>: Prozess f\u00fcr die Highspeed-Abscheidung von Zinn f\u00fcr L\u00f6t-Depot-Anwendungen. Dieser Prozess kann eingesetzt werden, wenn der L\u00f6tpastendruck und das Platzieren von Micro-balls an ihre Grenzen stossen.<\/li>\n<li><strong>StannoBond<sup>\u00ae<\/sup><\/strong>: Galvanisches Zinnbad f\u00fcr L\u00f6tanwendungen auf Copper Pillars und f\u00fcr sogenanntes Thermo Compression Bonding.<\/li>\n<\/ul>\n\t\t\t\t<\/div><div class='clear'><\/div>[\/et_pb_accordion_item][et_pb_accordion_item title=&#8220;RDL- und Pillar-Plating&#8220; _builder_version=&#8220;4.24.2&#8243; global_colors_info=&#8220;{}&#8220; open=&#8220;off&#8220;]<div class='one_fourth'>\n\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-4565 size-full\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2016\/02\/equipment-highlight-multiplate.jpg\" alt=\"Atotech\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2016\/02\/equipment-highlight-multiplate.jpg 300w, https:\/\/www.atotech.com\/wp-content\/uploads\/2016\/02\/equipment-highlight-multiplate-150x150.jpg 150w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>\n\t\t\t\t<\/div> <div class='three_fourth et_column_last'>\n\t\t\t\t\t<ul>\n<li>Die Produktfamilie <strong>Innolyte\u00ae <\/strong> wurde f\u00fcr MultiPlate\u00ae-Anlagen entwickelt. Unsere hochreinen Innolyte\u00ae-Chemikalien wurden entwickelt, um RDL-Strukturen und Pillars bei hohen Stromdichten abzuscheiden und dabei eine hervorragende Verteilung der abgeschiedenen Strukturen zu erzielen. Das abgeschiedene Kupfer ist von hochrein, um beste Materialeigenschaften f\u00fcr h\u00f6chste Zuverl\u00e4ssigkeit zu erzeugen.<\/li>\n<\/ul>\n\t\t\t\t<\/div><div class='clear'><\/div>[\/et_pb_accordion_item][et_pb_accordion_item title=&#8220;Vorbehandlung&#8220; _builder_version=&#8220;4.24.2&#8243; global_colors_info=&#8220;{}&#8220; open=&#8220;off&#8220;]<div class='one_fourth'>\n\t\t\t\t\t<div id=\"attachment_4389\" style=\"width: 260px\" class=\"wp-caption alignleft\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-4389\" class=\"wp-image-4389 size-full\" src=\"\/wp-content\/uploads\/2016\/05\/panel-pattern-plating-pretreatment.jpg\" alt=\"Atotech\" width=\"250\" height=\"164\"><p id=\"caption-attachment-4389\" class=\"wp-caption-text\">Cleaning for 3 min at 35 \u00b0C: no attack and no dry film lift off<\/p><\/div>\n\t\t\t\t<\/div> <div class='three_fourth et_column_last'>\n\t\t\t\t\t<ul>\n<li><strong>CupraPro\u00ae S8<\/strong>: Biologisch abbaubarer Reiniger f\u00fcr HDI Panel- und Pattern-Plating in Vertikal Gestell-Anlagen. CupraPro\u00ae S8 hat eine sehr geringe dynamische Oberfl\u00e4chenspannung und erzielt dadurch beste Benetzungs- und Reinigungsergebnisse bei reduzierter Ausschleppung.<\/li>\n<li><strong>CupraPro\u00ae MV<\/strong>: Biologisch abbaubarer Reiniger f\u00fcr Panel- und Pattern-Plating bei der Beschichtung von IC-Substraten, insbesondere in Vertikal Gestell-Anlagen. <strong>CupraPro\u00ae MV<\/strong> enth\u00e4lt kein NPE und erm\u00f6glicht dank seiner geringen dynamischen Oberfl\u00e4chenspannung eine schnelle und effektive Benetzung insbesondere f\u00fcr Via-Filling-Anwendungen bei gleichzeitig reduziertem Drag-Out.<\/li>\n<li><strong>CupraPro\u00ae VC<\/strong>: Ist ein neuer saurer Reiniger f\u00fcr Panel- und Pattern-Plating speziell entwickelt f\u00fcr den Einsatz in Vertikal Durchlaufanlagen (VCP). Der Reiniger zeichnet sich durch eine geringe Schaumbildung selbst bei stark turbulenter Str\u00f6mung aus und sorgt f\u00fcr eine schnelle und effektive Benetzung insbesondere bei Durchgangs- und Sacklochbohrungen mit hohem Aspektenverh\u00e4ltnis.<\/li>\n<\/ul>\n\t\t\t\t<\/div><div class='clear'><\/div>[\/et_pb_accordion_item][\/et_pb_accordion][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;section&#8220; module_class=&#8220;atotech-recommended-products background-4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; border_color_bottom=&#8220;#5c94d4&#8243; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;4_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;H2:Featured products&#8220; _builder_version=&#8220;4.16&#8243; text_text_color=&#8220;#e02b20&#8243; header_text_color=&#8220;#e02b20&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2 style=\"text-align: left;\">High Tech Platingtechnologie von Atotech<\/h2>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8220;1_3,1_3,1_3&#8243; admin_label=&#8220;row&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_3&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_blurb title=&#8220;InPro<sup>\u00ae<\/sup> THF \/ InPro<sup>\u00ae<\/sup> THF2&#8243; image=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/05\/th-filled-square.jpg&#8220; alt=&#8220;th-filled-square&#8220; icon_placement=&#8220;left&#8220; admin_label=&#8220;InPro\u00ae THF \/ THF 2&#8243; _builder_version=&#8220;4.19.2&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; link_option_url=&#8220;\/products\/electronics\/electrolytic-plating\/inpro-thf\/&#8220; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>Panel\/pattern via filling mit unl\u00f6slichen Anoden in vertikalen Durchlaufanlagen (VCP) f\u00fcr (a)mSAP Technologie<\/p>\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"https:\/\/www.atotech.com\/products\/electronics\/electrolytic-plating\/inpro-thf\/\">Erfahren sie mehr<\/a><\/p>\n<p>[\/et_pb_blurb][et_pb_code admin_label=&#8220;Abstand&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_code][\/et_pb_column][et_pb_column type=&#8220;1_3&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_blurb title=&#8220;InPro<sup>\u00ae<\/sup> MVF \/ InPro<sup>\u00ae<\/sup> MVF2&#8243; image=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/InPro-MVF-InPro-MVF2-teaser.jpg&#8220; alt=&#8220;InPro-MVF-InPro-MVF2-teaser&#8220; icon_placement=&#8220;left&#8220; admin_label=&#8220;InPro<sup>\u00ae<\/sup> MVF \/ InPro<sup>\u00ae<\/sup> MVF2&#8243; _builder_version=&#8220;4.19.2&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; link_option_url=&#8220;\/products\/electronics\/electrolytic-plating\/inpro-mvf-inpro-mvf2\/&#8220; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>Exzellente F\u00fclleigenschaften bei Sacklochbohrungen der n\u00e4chsten Generation von HDI Schaltungen, Flex und Automobil Anforderungen.<\/p>\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"https:\/\/www.atotech.com\/products\/electronics\/electrolytic-plating\/inpro-mvf-inpro-mvf2\/\">Erfahren sie mehr<\/a><\/p>\n<p>[\/et_pb_blurb][et_pb_blurb title=&#8220;Inpulse<sup>\u00ae<\/sup> 2THF&#8220; image=&#8220;\/wp-content\/uploads\/2016\/03\/pp-inpulse-2THF.jpg&#8220; icon_placement=&#8220;left&#8220; disabled_on=&#8220;on|on|on&#8220; admin_label=&#8220;Inpulse 2THF&#8220; _builder_version=&#8220;4.24.2&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; link_option_url=&#8220;\/inpulse-2thf\/&#8220; z_index_tablet=&#8220;500&#8243; use_border_color=&#8220;off&#8220; disabled=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220;]F\u00fcllen von Durchgangsbohrungen ohne Einschl\u00fcsse in Verbindung mit dem Horizontal \u2013 Plater Uniplate IP<sup>\u00ae<\/sup> 2<\/p>\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"inpulse-2thf\">Erfahren sie mehr<\/a><br \/>\n[\/et_pb_blurb][et_pb_code admin_label=&#8220;Abstand&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_code][\/et_pb_column][et_pb_column type=&#8220;1_3&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_blurb title=&#8220;Cupracid<sup>\u00ae<\/sup> TP5&#8243; image=&#8220;\/wp-content\/uploads\/2016\/02\/Cupracid-AC_BMV-1-bearb.jpg&#8220; icon_placement=&#8220;left&#8220; admin_label=&#8220;Cupracid AC&#8220; _builder_version=&#8220;4.27.4&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; z_index_tablet=&#8220;500&#8243; use_border_color=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>Kupferelektrolyt mit hoher Streuung Oberfl\u00e4che \/ Bohrung f\u00fcr die Produktion von<br \/>\nMLB-, HDI- und Automobilleiterplatten<\/p>\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"#\">Erfahren sie mehr<\/a><\/p>\n<p>[\/et_pb_blurb][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; disabled_on=&#8220;off|off|off&#8220; admin_label=&#8220;section&#8220; _builder_version=&#8220;4.16&#8243; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; transparent_background=&#8220;off&#8220; locked=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row admin_label=&#8220;row&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;4_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Headline&#8220; _builder_version=&#8220;4.24.2&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; module_alignment=&#8220;left&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2>Cupracid\u00ae AC5<\/h2>\n<h3>Konforme Kupferbeschichtung bei hohen Stromdichten in VCP- und Vertikal-Gestellanlagen<\/h3>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8220;2_3,1_3&#8243; admin_label=&#8220;row&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;2_3&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_video src=&#8220;https:\/\/www.youtube.com\/watch?v=BoqeKvZ2oBM&#8220; _builder_version=&#8220;4.19.2&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_video][\/et_pb_column][et_pb_column type=&#8220;1_3&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text _builder_version=&#8220;4.24.2&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>Unsere neue L\u00f6sung f\u00fcr konforme Kupferbeschichtung <b>Cupracid\u00ae AC5<\/b> wurde speziell f\u00fcr den Einsatz in VCPs bei hohen Stromdichten entwickelt. Bei einem Aspektverh\u00e4ltnis von bis zu 12:1 hat es das Potenzial, zum Industriestandard f\u00fcr hohe Streuf\u00e4higkeit in BMVs und Durchgangsbohrungen zu werden.<\/p>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;section&#8220; module_id=&#8220;Systems&#8220; _builder_version=&#8220;4.16&#8243; background_color=&#8220;#ffffff&#8220; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; transparent_background=&#8220;off&#8220; padding_mobile=&#8220;off&#8220; make_fullwidth=&#8220;off&#8220; use_custom_width=&#8220;off&#8220; width_unit=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row column_structure=&#8220;1_2,1_2&#8243; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;\/wp-content\/uploads\/2016\/02\/PP-Uniplate-InPulse2.jpg&#8220; show_in_lightbox=&#8220;on&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;center&#8220; align_last_edited=&#8220;on|desktop&#8220; _builder_version=&#8220;4.27.4&#8243; animation_style=&#8220;slide&#8220; animation_direction=&#8220;left&#8220; animation_duration=&#8220;500ms&#8220; animation_intensity_slide=&#8220;10%&#8220; use_border_color=&#8220;off&#8220; border_color=&#8220;#ffffff&#8220; border_style=&#8220;solid&#8220; animation=&#8220;left&#8220; sticky=&#8220;off&#8220; always_center_on_mobile=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][\/et_pb_column][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Uniplate InPulse 2&#8243; _builder_version=&#8220;4.27.4&#8243; text_font_size=&#8220;18&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; module_alignment=&#8220;left&#8220; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2>Uniplate<sup>\u00ae<\/sup> InPulse 2<\/h2>\n<h3>Das f\u00fchrende, ganzheitliche System f\u00fcr die galvanische Kupferabscheidung in Horizontal Durchlaufanlagen<\/h3>\n<p>Die Uniplate\u00ae InPulse 2-Anlagen und -Prozesse erf\u00fcllen alle Anforderungen f\u00fcr die High-End-Produktion von Leiterplatten bei hohen Stromdichten mit Reverse Pulse Plating und unl\u00f6slichen Anoden.<\/p>\n<ul>\n<li>Inpulse\u00ae 2HF9 \u2013 Atotechs SuperFilling\u00ae-Prozess f\u00fcr eine zuverl\u00e4ssige HDI-Massenfertigung mit Stacked-Via-Technologie.<\/li>\n<li>Inpulse\u00ae 2THF2 \u2013 einzigartiges Verfahren f\u00fcr einschlu\u00dffreies F\u00fcllen von Durchgangsbohrung bei minimaler Kupferschichtdicke<\/li>\n<li>Inpulse\u00ae 2HFU2 \u2013 optimale Vorbereitung von Sacklochbohrungen f\u00fcr die nachfolgenden Strukturierung und BMV Filling beim mSAP-Produktionsproze\u00df<\/li>\n<\/ul>\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"https:\/\/www.atotech.com\/products\/electronics\/electronics-equipment\/uniplate-ip2-advanced\/\">Erfahren Sie mehr<\/a>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;section&#8220; module_id=&#8220;Systems&#8220; _builder_version=&#8220;4.16&#8243; background_color=&#8220;#ffffff&#8220; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; transparent_background=&#8220;off&#8220; padding_mobile=&#8220;off&#8220; make_fullwidth=&#8220;off&#8220; use_custom_width=&#8220;off&#8220; width_unit=&#8220;on&#8220; locked=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row column_structure=&#8220;1_2,1_2&#8243; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Vplate&#8220; _builder_version=&#8220;4.27.4&#8243; text_font_size=&#8220;18&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; module_alignment=&#8220;left&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2>vPlate\u00ae<\/h2>\n<h3>Atotechs L\u00f6sung f\u00fcr die vertikalen Durchlaufanlagen<\/h3>\n<p>Die einzigartige vPlate\u00ae-Anlage bietet einzigartige technische Merkmale wie ein automatisches Schmiersystem und den automatischen Jig-Tester, um die beste Ergebnisse zu gew\u00e4hrleisten. Zusammen mit unseren InPro\u00ae- und Cuprapulse\u00ae-Prozessen deckt diese Kombination von Chemie und Anlage alle relevanten Anwendungen von MLB, HDI, ICS und Starrflex in Panel- und Pattern-Plating ab.<\/p>\n<ul>\n<li>Cuprapulse\u00ae IN \u2013 Erste Wahl f\u00fcr die konforme Beschichtung von HAR-Platinen mit der besten Streuung mittels Pulse Plating und unl\u00f6slichen Anoden.<\/li>\n<li>InPro\u00ae SAP3 \u2013 Einschlu\u00dffreies F\u00fcllen von Sacklochbohrungen bei minimaler Kupferschichtdicke f\u00fcr ICS-Anwendungen.<\/li>\n<li>InPro THF2 \u2013 Eignet sich nicht nur f\u00fcr zuverl\u00e4ssiges Verf\u00fcllen von Durchgangsbohrungen, sondern bietet auch ein hervorragendes BMV-F\u00fcllverhalten, hohe Oberfl\u00e4chenverteilung und erh\u00f6hte Duktilit\u00e4t speziell f\u00fcr den (a)mSAP-Herstellungsproze\u00df.<\/li>\n<li>InPro\u00ae VLF \u2013 Wenn Sie nach besserer Oberfl\u00e4chenverteilung, h\u00f6herer Stromdichte, h\u00f6herem Durchsatz und geringerer Wartung bei der konformen Beschichtung suchen, ist InPro\u00ae VLF die richtige Wahl.<\/li>\n<\/ul>\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"https:\/\/www.atotech.com\/products\/electronics\/electronics-equipment\/vplate\/\">Erfahren Sie mehr<\/a><\/p>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2022\/10\/vPlate-114-transparent-background_vPlate_v1-2022-01-25-v2-scaled.jpg&#8220; alt=&#8220;Atotech &#8211; Electrolytic plating &#8211; vPlate&#8220; title_text=&#8220;vPlate PP&#8220; show_in_lightbox=&#8220;on&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;&#8220; align_last_edited=&#8220;on|desktop&#8220; _builder_version=&#8220;4.27.4&#8243; animation_style=&#8220;slide&#8220; animation_direction=&#8220;left&#8220; animation_duration=&#8220;500ms&#8220; animation_intensity_slide=&#8220;10%&#8220; use_border_color=&#8220;off&#8220; border_color=&#8220;#ffffff&#8220; border_style=&#8220;solid&#8220; animation=&#8220;left&#8220; sticky=&#8220;off&#8220; always_center_on_mobile=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;section&#8220; module_id=&#8220;Systems&#8220; _builder_version=&#8220;4.16&#8243; background_color=&#8220;#ffffff&#8220; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; transparent_background=&#8220;off&#8220; padding_mobile=&#8220;off&#8220; make_fullwidth=&#8220;off&#8220; use_custom_width=&#8220;off&#8220; width_unit=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row column_structure=&#8220;1_2,1_2&#8243; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;MultiPlate\u00ae P&#8220; _builder_version=&#8220;4.16&#8243; text_font_size=&#8220;18&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; module_alignment=&#8220;left&#8220; z_index_tablet=&#8220;500&#8243; border_style=&#8220;solid&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2>MultiPlate<sup>\u00ae<\/sup> P<\/h2>\n<h3>Die L\u00f6sung von Atotech f\u00fcr die Packaging-Technologien der n\u00e4chsten Generation<\/h3>\n<ul>\n<li>MultiPlate\u00ae ist das ECD-System, das die Vielseitigkeit und Multifunktionalit\u00e4t bietet, die notwendig ist, um aktuelle und zuk\u00fcnftige Herausforderungen f\u00fcr eine optimale Performance hochentwickelter Packaging-Technologien zu bew\u00e4ltigen. Das MultiPlate\u00ae P-System ist f\u00fcr Panel-Level-Packaging konzipiert und kann Panels bis zu einer Gr\u00f6\u00dfe von 650 \u00d7 610 mm verarbeiten.<\/li>\n<li>Innolyte\u00ae PLP \u2013 Der RDL- und Via-Filling-Prozess bietet eine sehr gute Oberfl\u00e4chenverteilung und Via-Filling-Performance und zugleich rechteckig abgeschiedene Leiterbahnen.<\/li>\n<li>Innolyte\u00ae P \u2013 F\u00fcr Copper-Pillar-Plating f\u00fcr eine hochreine Abscheidung bei Stromdichten von bis zu 20 A\/dm\u00b2 ohne Einschl\u00fcsse in IMC und bester Gleichm\u00e4\u00dfigkeit.<\/li>\n<\/ul>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/12\/Multiplate_P.jpg&#8220; alt=&#8220;Multiplate_P&#8220; show_in_lightbox=&#8220;on&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;center&#8220; align_last_edited=&#8220;on|desktop&#8220; _builder_version=&#8220;4.16&#8243; animation_style=&#8220;slide&#8220; animation_direction=&#8220;left&#8220; animation_duration=&#8220;500ms&#8220; animation_intensity_slide=&#8220;10%&#8220; use_border_color=&#8220;off&#8220; animation=&#8220;left&#8220; sticky=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; disabled_on=&#8220;on|on|on&#8220; admin_label=&#8220;section&#8220; module_class=&#8220;revamp-quote backgrounds-4&#8243; _builder_version=&#8220;4.27.4&#8243; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; hover_enabled=&#8220;0&#8243; da_disable_devices=&#8220;off|off|off&#8220; border_width_bottom=&#8220;1px&#8220; border_color_bottom=&#8220;#5c94d4&#8243; transparent_background=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220; sticky_enabled=&#8220;0&#8243; disabled=&#8220;on&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row column_structure=&#8220;1_2,1_2&#8243; admin_label=&#8220;row&#8220; module_class=&#8220;centered-textblock background-1&#8243; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Zitat (Did you know)&#8220; module_class=&#8220;quote-area&#8220; _builder_version=&#8220;4.16&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>\u201cWe offer cost-efficient solutions to the PCB and FOPLP industry with the full spectrum of applications for electrolytic plating of Cu, Sn, Ni, Pd, Au and suitable pre-treatments. Our portfolio comprises of processes for all types of equipment from horizontal to VCP and hoist type systems.&#8220;<\/p>\n<p>[\/et_pb_text][et_pb_text _builder_version=&#8220;4.16&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<p>Bert Reents<br \/> Global Product Director Electrolytic Plating at Atotech Germany<\/p>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/08\/reents_8565_klein.jpg&#8220; alt=&#8220;reents_8565_klein&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;center&#8220; align_last_edited=&#8220;on|desktop&#8220; _builder_version=&#8220;4.16&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;section&#8220; module_class=&#8220;blurb-list background-4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;||100px|&#8220; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; border_color_bottom=&#8220;#5c94d4&#8243; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;4_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;H2: Aktuelle Ver\u00f6ffentlichungen&#8220; _builder_version=&#8220;4.16&#8243; text_text_color=&#8220;#e02b20&#8243; header_text_color=&#8220;#e02b20&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2 style=\"text-align: left;\">Aktuelle Ver\u00f6ffentlichungen<\/h2>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8220;1_2,1_2&#8243; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_blurb title=&#8220;Das F\u00fcllen von Sackloch- und Durchgangsbohrungen mit galvanisch Kupfer-Prozessen \u2013 Aktueller Stand und Ausblick&#8220; url=&#8220;\/wp-content\/uploads\/2019\/03\/IPC_APEX_2019_Filling-of-BMVs-and-THs-by-Electrolytic-Copper-Plating.pdf&#8220; url_new_window=&#8220;on&#8220; use_icon=&#8220;on&#8220; font_icon=&#8220;&#x68;||divi||400&#8243; icon_color=&#8220;#5992d6&#8243; icon_placement=&#8220;left&#8220; admin_label=&#8220;Das F\u00fcllen von Sackloch- und Durchgangsbohrungen mit galvanisch Kupfer-Prozessen \u2013 Aktueller Stand und Ausblick&#8220; _builder_version=&#8220;4.16&#8243; header_text_color=&#8220;#5992d6&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]Dieser Artikel wurde in Zusammenarbeit mit der GreenSource Fabrication LLC. USA erstellt und erstmals auf der IPC APEX EXPO 2019 pr\u00e4sentiert. In dem Artikel werden die Gr\u00fcnde f\u00fcr die Entwicklung von Via-Filling mit galvanischen Kupferprozessen beschrieben und beinhaltet eine Roadmap f\u00fcr das F\u00fcllen von Durchgangs- und Sacklochbohrungen mit Bezug auf ihre Dimensionen. Zudem werden Aspekte anderer kupferbeschichteter Strukturen auf Leiterplatten thematisiert. Dar\u00fcber hinaus sind Machbarkeitsstudien f\u00fcr zuk\u00fcnftige Anwendungen wie zum Beispiel Copper-Pillar-Plating bei IC-Substraten enthalten.<\/p>\n<p>2019, PDF, 540 KB<br \/>\n[\/et_pb_blurb][\/et_pb_column][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_blurb title=&#8220;Vergr\u00f6\u00dferung des Fertigungsformats f\u00fcr die Verkupferung bei FOPLP (Fan Out Panel Level Packaging) zur Senkung der Herstellungskosten&#8220; url=&#8220;\/wp-content\/uploads\/2019\/03\/2018-09-14_IMAPS2018_Upscaling-panel-size-for-Cu-plating-on-FOPLP-applications-to-reduce-manufacturing_rev.pdf&#8220; url_new_window=&#8220;on&#8220; use_icon=&#8220;on&#8220; font_icon=&#8220;&#x68;||divi||400&#8243; icon_color=&#8220;#ffffff&#8220; icon_placement=&#8220;left&#8220; admin_label=&#8220;Vergr\u00f6\u00dferung des Fertigungsformats f\u00fcr die Verkupferung bei FOPLP (Fan Out Panel Level Packaging) zur Senkung der Herstellungskosten&#8220; _builder_version=&#8220;4.16&#8243; header_text_color=&#8220;#5992d6&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]Die st\u00e4ndig wachsende Nachfrage nach leistungsf\u00e4higeren, kosteng\u00fcnstigeren und d\u00fcnneren Endger\u00e4ten wie Smartphones erfordert intensive Entwicklungen und Innovationen in allen Bereichen der Entwicklung elektronischer Komponenten, einschlie\u00dflich des Substrat- und Chip-Packagings. Neue Fertigungstechnologien wie z.B. Fan-Out-Wafer-Level-Packaging und andere Hightech-Substrate werden kontinuierlich weiterentwickelt und versprechen ein entscheidendes Element bei der Erf\u00fcllung dieser Anforderungen zu sein. In dem Artikel werden die neuesten Studien und Schlussfolgerungen in kritischen Leistungsbereichen des Beschichtungsprozesses vorgestellt, wie z. B. die Elektrolytbewegung, Einfluss des Anodenauslegung, Reverse Pulse Plating und neu entwickelte Elektrolyte f\u00fcr Panelgr\u00f6\u00dfen von bis zu 600 mm.<br \/>\nDieser Artikel wurde urspr\u00fcnglich auf der IMAPS 2018 in Pasadena ver\u00f6ffentlicht.<\/p>\n<p>2018, PDF, 900 KB<br \/>\n[\/et_pb_blurb][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8220;1_2,1_2&#8243; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_blurb title=&#8220;Steigerung der Produktivit\u00e4t bei der Herstellung von IC-Substraten durch die Verwendung eines neuartigen Kupferelektrolyten f\u00fcr die Semi Additive Plating&#8220; url=&#8220;\/wp-content\/uploads\/2019\/03\/2018-10_EPTC-Sigapore_novel-Copper-Electrolyte-for-SAP.pdf&#8220; url_new_window=&#8220;on&#8220; use_icon=&#8220;on&#8220; font_icon=&#8220;&#x68;||divi||400&#8243; icon_color=&#8220;#5992d6&#8243; icon_placement=&#8220;left&#8220; admin_label=&#8220;Steigerung der Produktivit\u00e4t bei der Herstellung von IC-Substraten durch die Verwendung eines neuartigen Kupferelektrolyten f\u00fcr die Semi Additive Plating&#8220; _builder_version=&#8220;4.16&#8243; header_text_color=&#8220;#5992d6&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]Das Semi-Additivverfahren (SAP) hat in den letzten Jahren an Attraktivit\u00e4t gewonnen, weil es sehr geringe Leiterbahnbreiten und -abst\u00e4nde bei der Herstellung von IC-Substraten erm\u00f6glicht. Bei Leiterbahnbreiten und -abst\u00e4nden (L\/S) von 10\/10 \u03bcm und weniger ist die Varianz der Kupferschichtdicke einer der entscheidenden Parameter, die in einem engen Bereich eingehalten werden muss, um Probleme bei der Best\u00fcckung oder w\u00e4hrend der Nutzungsdauer zu vermeiden. Diese Abhandlung enth\u00e4lt die Ergebnisse der Untersuchungen der Autoren zu Atotech\u2018s neuesten Via-Filling Prozess f\u00fcr IC-Substrate in Bezug auf die Varianz der Kupferschichtdicken (WUD), Dimple-Ergebnisse, Filling-Performance und Schliffbilder.<br \/>\nDieser Artikel wurde urspr\u00fcnglich auf der EPTC 2018 in Singapur ver\u00f6ffentlicht.<\/p>\n<p>2018, PDF, 320 KB<br \/>\n[\/et_pb_blurb][\/et_pb_column][et_pb_column type=&#8220;1_2&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_blurb title=&#8220;Fine-Line-TH-Copper Filling in VCP-Anlagen f\u00fcr die n\u00e4chste Packaging-Generation&#8220; url=&#8220;\/wp-content\/uploads\/2019\/03\/2017_SMTA_Fine-line-TH-copper-filling-in-VCP-for-next-gen.-packaging.pdf&#8220; url_new_window=&#8220;on&#8220; use_icon=&#8220;on&#8220; font_icon=&#8220;&#x68;||divi||400&#8243; icon_color=&#8220;#5992d6&#8243; icon_placement=&#8220;left&#8220; admin_label=&#8220;Fine-Line-TH-Copper Filling in VCP-Anlagen f\u00fcr die n\u00e4chste Packaging-Generation&#8220; _builder_version=&#8220;4.16&#8243; header_text_color=&#8220;#5992d6&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; max_width_tablet=&#8220;50px&#8220; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]In diesem Artikel wird das F\u00fcllen von Durchgangsbohrungen mit galvanisch abgeschiedenen Kupfer bei den Kernen f\u00fcr die IC-Package-Produktion vorgestellt, insbesondere f\u00fcr FC-BGA- und FC-CSP- Anwendungen. Detailliert wird der Einfluss der Elektrolytbewegung, Stromdichte, anorganischen und organischen Konzentrationen auf das F\u00fcllverhalten beschrieben und diskutiert. Das Ergebnis unserer Untersuchungen ist ein Prozess mit verbesserter Filling-Performance bei Durchgangsbohrungen mit einer geringsten Auftrittswahrscheinlichkeit von Einschl\u00fcssen und hervorragender Oberfl\u00e4chenverteilung.<br \/>\nDieser Artikel wurde urspr\u00fcnglich auf der SMTA 2017 in Chicago ver\u00f6ffentlicht.<\/p>\n<p>2017, PDF, 510 KB<br \/>\n[\/et_pb_blurb][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; module_class=&#8220;portfolio-grid&#8220; _builder_version=&#8220;4.16&#8243; da_disable_devices=&#8220;off|off|off&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row column_structure=&#8220;2_3,1_3&#8243; module_id=&#8220;portfolio&#8220; _builder_version=&#8220;4.16&#8243; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;2_3&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Portfolio overview&#8220; module_id=&#8220;product-overview&#8220; _builder_version=&#8220;4.16&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2>\u00dcbersicht Portfolio<\/h2>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_3&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8220;1_4,1_4,1_4,1_4&#8243; admin_label=&#8220;row&#8220; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-surface-treatment.jpg&#8220; alt=&#8220;el-intro-surface- treatment&#8220; url=&#8220;https:\/\/www.atotech.com\/de\/produkte\/electronics\/oberflaechenbehandlung\/&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;center&#8220; align_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;Image Surface treatment&#8220; _builder_version=&#8220;4.16&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][et_pb_text admin_label=&#8220;Link Surface treatment&#8220; _builder_version=&#8220;4.16&#8243; custom_margin=&#8220;-10px|||&#8220; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<a href="https:\/\/www.atotech.com\/de\/produkte\/electronics\/oberflaechenbehandlung\/" class='small-button smallblue'>Oberfl\u00e4chenbehandlung<\/a>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-desmear-and-metallization.jpg&#8220; alt=&#8220;el-intro-desmear-and-metallization&#8220; url=&#8220;\/de\/produkte\/electronics\/desmear-und-metallisierung\/&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;center&#8220; align_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;Image Desmear and metallization&#8220; _builder_version=&#8220;4.19.2&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][et_pb_text admin_label=&#8220;Link Desmear and metallization&#8220; _builder_version=&#8220;4.19.2&#8243; custom_margin=&#8220;-10px|||&#8220; link_option_url=&#8220;\/de\/produkte\/electronics\/desmear-und-metallisierung\/&#8220; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<a href="\/de\/produkte\/electronics\/desmear-und-metallisierung\/" class='small-button smallblue'>Desmear und Metallisierung<\/a>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-final-finishing.jpg&#8220; alt=&#8220;el-intro-final-finishing&#8220; url=&#8220;https:\/\/www.atotech.com\/de\/produkte\/electronics\/endoberflaechen\/&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;center&#8220; align_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;Image Final finishing&#8220; _builder_version=&#8220;4.16&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][et_pb_text admin_label=&#8220;Link Final finishing&#8220; _builder_version=&#8220;4.16&#8243; custom_margin=&#8220;-10px|||&#8220; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<a href="https:\/\/www.atotech.com\/de\/produkte\/electronics\/endoberflaechen\/" class='small-button smallblue'>Endoberfl\u00e4chen<\/a>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-leadframe-and-connector.jpg&#8220; alt=&#8220;el-intro-leadframe-and-connector&#8220; url=&#8220;https:\/\/www.atotech.com\/de\/produkte\/electronics\/leadframe-und-steckverbindungen\/&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;center&#8220; align_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;Image Leadframe and connector&#8220; _builder_version=&#8220;4.16&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][et_pb_text admin_label=&#8220;Link Leadframe and connector&#8220; _builder_version=&#8220;4.16&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<a href="https:\/\/www.atotech.com\/de\/produkte\/electronics\/leadframe-und-steckverbindungen\/" class='small-button smallblue'>Leadframes und Steckverbindungen<\/a>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8220;1_4,1_4,1_4,1_4&#8243; _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;1_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-sc.jpg&#8220; alt=&#8220;el-intro-sc&#8220; url=&#8220;https:\/\/www.atotech.com\/de\/produkte\/electronics\/halbleiter\/&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;center&#8220; align_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;Image Semiconductor&#8220; _builder_version=&#8220;4.16&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][et_pb_text admin_label=&#8220;Link Semiconductor&#8220; _builder_version=&#8220;4.16&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<a href="https:\/\/www.atotech.com\/de\/produkte\/electronics\/halbleiter\/" class='small-button smallblue'>Halbleiter<\/a>\n<p>&nbsp;<\/p>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_image src=&#8220;https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-equipment.jpg&#8220; alt=&#8220;el-intro-equipment&#8220; url=&#8220;https:\/\/www.atotech.com\/de\/produkte\/electronics\/electronics-anlagentechnologie\/&#8220; align_tablet=&#8220;center&#8220; align_phone=&#8220;center&#8220; align_last_edited=&#8220;on|desktop&#8220; admin_label=&#8220;Image Equipment&#8220; _builder_version=&#8220;4.16&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;][\/et_pb_image][et_pb_text admin_label=&#8220;Link Equipment&#8220; _builder_version=&#8220;4.16&#8243; z_index_tablet=&#8220;500&#8243; global_colors_info=&#8220;{}&#8220;]<\/p>\n<a href="https:\/\/www.atotech.com\/de\/produkte\/electronics\/electronics-anlagentechnologie\/" class='small-button smallblue'>Anlagen<\/a>\n<p>&nbsp;<\/p>\n<p>[\/et_pb_text][\/et_pb_column][et_pb_column type=&#8220;1_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][\/et_pb_column][et_pb_column type=&#8220;1_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=&#8220;1&#8243; custom_padding_last_edited=&#8220;on|desktop&#8220; module_id=&#8220;contact&#8220; _builder_version=&#8220;4.16&#8243; custom_padding_tablet=&#8220;50px|0|50px|0&#8243; custom_padding_phone=&#8220;&#8220; da_disable_devices=&#8220;off|off|off&#8220; transparent_background=&#8220;off&#8220; padding_mobile=&#8220;off&#8220; make_fullwidth=&#8220;off&#8220; use_custom_width=&#8220;off&#8220; width_unit=&#8220;on&#8220; global_colors_info=&#8220;{}&#8220; da_is_popup=&#8220;off&#8220; da_exit_intent=&#8220;off&#8220; da_has_close=&#8220;on&#8220; da_alt_close=&#8220;off&#8220; da_dark_close=&#8220;off&#8220; da_not_modal=&#8220;on&#8220; da_is_singular=&#8220;off&#8220; da_with_loader=&#8220;off&#8220; da_has_shadow=&#8220;on&#8220;][et_pb_row _builder_version=&#8220;4.16&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; global_colors_info=&#8220;{}&#8220;][et_pb_column type=&#8220;4_4&#8243; _builder_version=&#8220;4.16&#8243; custom_padding=&#8220;|||&#8220; global_colors_info=&#8220;{}&#8220; custom_padding__hover=&#8220;|||&#8220;][et_pb_text admin_label=&#8220;Schreiben Sie uns&#8220; _builder_version=&#8220;4.23.1&#8243; background_size=&#8220;initial&#8220; background_position=&#8220;top_left&#8220; background_repeat=&#8220;repeat&#8220; module_alignment=&#8220;center&#8220; z_index_tablet=&#8220;500&#8243; use_border_color=&#8220;off&#8220; global_colors_info=&#8220;{}&#8220;]<\/p>\n<h2>Schreiben Sie uns<\/h2>\n<p class=\"wpcf7-contact-form-not-found\"><strong>Fehler:<\/strong> Kontaktformular wurde nicht gefunden.<\/p>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section]<\/p>\n","protected":false},"excerpt":{"rendered":"<p>F\u00fchrende galvanische Kupferb\u00e4der f\u00fcr Panel- und Pattern Plating und f\u00fcr das F\u00fcllen von Sackloch- und Durchgangsbohrungen sowie Vorbehandlungen und galvanische B\u00e4der f\u00fcr Endoberfl\u00e4chen Unser Produktportfolio <nav class=\"atotech-breadcrumb\"><a href=\"https:\/\/www.atotech.com\/de\/\">Home<\/a> <span class=\"bc-divider\"><i class=\"icon-arrow\"><\/i><\/span> <span class=\"current-page\">Seite<\/span><\/nav> Elektrolytische Metallabscheidung Ganzheitliches System von nasschemischer Verfahrens- und Anlagentechnik f\u00fcr Package-Substrate und LeiterplattenFakten im \u00dcberblick Elektrolytische Metallabscheidung f\u00fcr h\u00f6chste Anforderungen an Zuverl\u00e4ssigkeit und Produktivit\u00e4t L\u00f6sungen f\u00fcr verschiedene Anlagentypen: Uniplate\u00ae [&hellip;]<\/p>\n","protected":false},"author":4,"featured_media":0,"parent":46889,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"_et_pb_use_builder":"on","_et_pb_old_content":"[et_pb_section bb_built=\"1\" admin_label=\"section\" fullwidth=\"on\" specialty=\"off\" transparent_background=\"off\" allow_player_pause=\"off\" inner_shadow=\"off\" parallax=\"off\" parallax_method=\"off\" padding_mobile=\"off\" make_fullwidth=\"off\" use_custom_width=\"off\" width_unit=\"on\" make_equal=\"off\" use_custom_gutter=\"off\" gutter_width=\"3\" module_class=\"Top\" custom_padding_tablet=\"50px|0|50px|0\" custom_padding_last_edited=\"on|desktop\" next_background_color=\"#000000\" _builder_version=\"3.17.6\" inner_width=\"auto\" inner_max_width=\"none\"][et_pb_fullwidth_slider admin_label=\"Hero Slider Small\" show_arrows=\"off\" 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header_text_shadow_blur_strength=\"0em\" body_text_shadow_horizontal_length=\"0em\" body_text_shadow_vertical_length=\"0em\" body_text_shadow_blur_strength=\"0em\" button_text_shadow_horizontal_length=\"0em\" button_text_shadow_vertical_length=\"0em\" button_text_shadow_blur_strength=\"0em\"]\r\n\r\n<div class=\"slidercontent-left\">\r\n<h3>Leading electrolytes for conformal plating, BMV and<\/h3>\r\n<h3>THF, pretreatment solutions and electrolytic finishes<\/h3>\r\n<a class=\"et_pb_more_button et_pb_button\" href=\"#ProductPortfolio\">Our product portfolio<\/a>\r\n\r\n<\/div>\r\n\r\n[\/et_pb_slide][\/et_pb_fullwidth_slider][\/et_pb_section][et_pb_section bb_built=\"1\" admin_label=\"section\" transparent_background=\"off\" allow_player_pause=\"off\" inner_shadow=\"off\" parallax=\"off\" parallax_method=\"off\" custom_padding=\"0|||\" padding_mobile=\"off\" make_fullwidth=\"off\" use_custom_width=\"off\" width_unit=\"on\" make_equal=\"off\" use_custom_gutter=\"off\" module_class=\"breadcrumb-container\" gutter_width=\"3\" custom_padding_tablet=\"50px|0|50px|0\" custom_padding_last_edited=\"on|desktop\" prev_background_color=\"#ffffff\" next_background_color=\"#ffffff\" inner_width=\"auto\" inner_max_width=\"none\"][et_pb_row admin_label=\"row\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" width=\"80%\" max_width=\"1080px\"][et_pb_column type=\"4_4\"][et_pb_text admin_label=\"Breadcrumbs\" background_layout=\"light\" text_orientation=\"left\" text_font_size=\"14\" use_border_color=\"off\" border_color=\"#ffffff\" border_style=\"solid\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" module_alignment=\"left\"]\r\n\r\n<p>\r\n[atotech_breadcrumbs]<\/p>\r\n\r\n[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section bb_built=\"1\" admin_label=\"section\" transparent_background=\"off\" allow_player_pause=\"off\" inner_shadow=\"off\" parallax=\"off\" parallax_method=\"off\" custom_padding=\"0|||\" padding_mobile=\"off\" make_fullwidth=\"off\" use_custom_width=\"off\" width_unit=\"on\" make_equal=\"off\" use_custom_gutter=\"off\" module_class=\"atotech-detailheader\" gutter_width=\"3\" custom_padding_tablet=\"50px|0|50px|0\" custom_padding_last_edited=\"on|desktop\" prev_background_color=\"#000000\" next_background_color=\"#000000\" _builder_version=\"3.17.6\" inner_width=\"auto\" inner_max_width=\"none\"][et_pb_row admin_label=\"row\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" width=\"80%\" max_width=\"1080px\"][et_pb_column type=\"4_4\"][et_pb_text admin_label=\"Electrolytic plating\" text_orientation=\"center\" use_border_color=\"off\" custom_margin=\"20|||\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" module_alignment=\"center\" _builder_version=\"3.17.6\"]\r\n\r\n<h1>Electrolytic plating<\/h1>\r\n<h2>Integrated wet chemical process and equipment solutions for package substrates and printed circuit boards (HDI\/MLB and Flex\/Flex-Rigid)<\/h2>\r\n\r\n[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row admin_label=\"row\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" width=\"80%\" max_width=\"1080px\"][et_pb_column type=\"1_2\"][et_pb_text _builder_version=\"3.17.6\" module_class=\"same-height list-line-style\"]\r\n\r\n<h4>Quick facts<\/h4>\r\n<ul class=\"facts\">\r\n<li>Electrolytic plating for the highest requirements in reliability and productivity<\/li>\r\n<li>Solutions for various equipment types: Uniplate<sup>\u00ae<\/sup> IP2, vertical conveyorised lines, conventional hoist type<\/li>\r\n<li>Market leading Uniplate<sup>\u00ae<\/sup> IP2 equipment for horizontal conveyorized production<\/li>\r\n<\/ul>\r\n\r\n[\/et_pb_text][\/et_pb_column][et_pb_column type=\"1_2\"][et_pb_text _builder_version=\"3.17.6\" module_class=\"same-height list-line-style\"]\r\n\r\n<h4>Applications<\/h4>\r\n<ul>\r\n<li>Conformal plating<\/li>\r\n<li>BMV filling<\/li>\r\n<li>TH filling<\/li>\r\n<li>Pretreatment<\/li>\r\n<li>Metal resist, electrolytic final finishes<\/li>\r\n<\/ul>\r\n\r\n[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section bb_built=\"1\" admin_label=\"section\" fullwidth=\"on\" specialty=\"off\" parallax_method=\"off\" custom_padding_tablet=\"50px|0|50px|0\" custom_padding_last_edited=\"on|desktop\" prev_background_color=\"#000000\" next_background_color=\"#000000\" _builder_version=\"3.17.6\" disabled=\"on\" disabled_on=\"on|on|on\" inner_width=\"auto\" inner_max_width=\"none\"][et_pb_fullwidth_menu menu_id=\"35\" background_color=\"#5992d6\" background_layout=\"dark\" text_orientation=\"center\" submenu_direction=\"downwards\" fullwidth_menu=\"off\" dropdown_menu_animation=\"fade\" module_id=\"atotech-sticky-nav\" \/][\/et_pb_section][et_pb_section bb_built=\"1\" admin_label=\"section\" fullwidth=\"off\" specialty=\"off\" transparent_background=\"off\" allow_player_pause=\"off\" inner_shadow=\"off\" parallax=\"off\" parallax_method=\"off\" padding_mobile=\"off\" make_fullwidth=\"off\" use_custom_width=\"off\" width_unit=\"on\" make_equal=\"off\" use_custom_gutter=\"off\" background_color=\"#ffffff\" gutter_width=\"3\" module_id=\"ProductPortfolio\" custom_padding_tablet=\"50px|0|50px|0\" custom_padding_last_edited=\"on|desktop\" prev_background_color=\"#000000\" next_background_color=\"#000000\" inner_width=\"auto\" inner_max_width=\"none\"][et_pb_row admin_label=\"row\" make_fullwidth=\"off\" use_custom_width=\"off\" width_unit=\"on\" use_custom_gutter=\"off\" gutter_width=\"3\" padding_mobile=\"off\" allow_player_pause=\"off\" parallax=\"off\" parallax_method=\"off\" make_equal=\"off\" parallax_1=\"off\" parallax_method_1=\"off\" column_padding_mobile=\"on\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" width=\"80%\" max_width=\"1080px\"][et_pb_column type=\"4_4\"][et_pb_text admin_label=\"Product portfolio\" use_border_color=\"off\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" module_alignment=\"center\" _builder_version=\"3.17.6\"]\r\n\r\n<h2>Product portfolio<\/h2>\r\n\r\n[\/et_pb_text][et_pb_accordion body_font_size=\"17\" _builder_version=\"3.22.7\" text_shadow_horizontal_length=\"text_shadow_style,%91object Object%93\" text_shadow_vertical_length=\"text_shadow_style,%91object Object%93\" text_shadow_blur_strength=\"text_shadow_style,%91object Object%93\" body_text_shadow_horizontal_length=\"body_text_shadow_style,%91object Object%93\" body_text_shadow_vertical_length=\"body_text_shadow_style,%91object Object%93\" body_text_shadow_blur_strength=\"body_text_shadow_style,%91object Object%93\" toggle_text_shadow_horizontal_length=\"toggle_text_shadow_style,%91object Object%93\" toggle_text_shadow_vertical_length=\"toggle_text_shadow_style,%91object Object%93\" toggle_text_shadow_blur_strength=\"toggle_text_shadow_style,%91object Object%93\" z_index_tablet=\"500\"][et_pb_accordion_item title=\"Conformal copper plating\" _builder_version=\"3.22.7\" link_option_url_new_window=\"off\" use_background_color_gradient=\"off\" background_color_gradient_start=\"#2b87da\" background_color_gradient_end=\"#29c4a9\" background_color_gradient_type=\"linear\" background_color_gradient_direction=\"180deg\" background_color_gradient_direction_radial=\"center\" background_color_gradient_start_position=\"0%\" background_color_gradient_end_position=\"100%\" background_color_gradient_overlays_image=\"off\" parallax=\"off\" parallax_method=\"on\" background_size=\"cover\" background_position=\"center\" background_repeat=\"no-repeat\" background_blend=\"normal\" allow_player_pause=\"off\" background_video_pause_outside_viewport=\"on\" text_shadow_style=\"none\" box_shadow_style=\"none\" hover_transition_duration=\"300ms\" hover_transition_delay=\"0ms\" hover_transition_speed_curve=\"ease\" text_shadow_horizontal_length=\"0em\" text_shadow_vertical_length=\"0em\" text_shadow_blur_strength=\"0em\" box_shadow_horizontal=\"box_shadow_style,%91object Object%93\" box_shadow_vertical=\"box_shadow_style,%91object Object%93\" box_shadow_blur=\"box_shadow_style,%91object Object%93\" box_shadow_spread=\"box_shadow_style,%91object Object%93\"]\r\n\r\n<p>[one_fourth]<\/p>[caption id=\"attachment_4351\" align=\"alignleft\" width=\"250\"]<img class=\"wp-image-39538\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2016\/05\/el-pp-conformal-copper-plating-147x300.jpg\" alt=\"Atotech\" width=\"250\" height=\"508\"> Panel 2.4 mm thickness incl. flash copper, hole diameter 0.2 mm, aspect ratio: 12:1, throwing power: > 85%[\/caption]<p>[\/one_fourth][three_fourth_last]<\/p><ul><li>High volume conformal plating production in <strong>Uniplate<sup>\u00ae<\/sup> InPulse 2 equipment<\/strong>: Inpulse<sup>\u00ae<\/sup> 2HFU is masking drilling defects and provides reliable coverage of wedge voids thanks to its superior throwing power in BMVs. The process is the ideal solution for reliable mSAP flash plating. Inpulse<sup>\u00ae<\/sup> 2HT assures best plating uniformity in through holes with significantly improved surface plated copper distribution, comparing high and low hole density areas.<\/li><li>The latest version of Atotech\u2019s <strong>Cupracid<sup>\u00ae<\/sup> TP series: Cupracid<sup>\u00ae<\/sup> TP3.<\/strong> This is an electrolytic copper plating process for conventional hoist type DC equipment using soluble anodes. It provides outstanding throwing power at high current densities and low surface tension for the comprehensive wetting of BMVs and through holes. Cupracid<sup>\u00ae<\/sup> TP3 offers excellent reliability results. It is a very robust process with stable plating performance after idle time.<\/li><li><strong>Cupracid<sup>\u00ae<\/sup> AC<\/strong> is for conformal copper plating with soluble anodes. It provides excellent throwing power in both BMVs and Through Holes at high current densities. Cupracid<sup>\u00ae<\/sup> AC is compatible with a wide range of vertical conveyorised systems with sparger electrolyte agitation as well as hoist type equipments with air agitation.<\/li><li><strong>Cuprapulse<sup>\u00ae<\/sup> XP7<\/strong> for soluble anode systems is our pulse plating solution for high aspect ratio conformal copper plating. DC technology does not even come close to the throwing power performance achieved with Cuprapulse\u00ae XP7. High current density pulse plating allows for increased productivity with simultaneous quality improvements such as better surface distribution and line shape.<\/li><li>Especially for the requirements of the flex\/ rigid-flex market, we have developed <strong>InPro\u00ae FLEX \/ Cupracid\u00ae FLEX<\/strong>. Both processes target conformal copper plating at high current densities and provide excellent throwing power in Through Holes. The deposits plated with both processes exhibit excellent crystal structure, ductility and flexibility for the highest reliability in flex application. InPro\u00ae FLEX is for use with insoluble anodes, Cupracid\u00ae FLEX operates with soluble anodes.<\/li><\/ul><p>[\/three_fourth_last]<\/p>\r\n\r\n[\/et_pb_accordion_item][et_pb_accordion_item title=\"Copper BMV filling\" _builder_version=\"3.22.7\" use_background_color_gradient=\"off\" background_color_gradient_start=\"#2b87da\" background_color_gradient_end=\"#29c4a9\" background_color_gradient_type=\"linear\" background_color_gradient_direction=\"180deg\" background_color_gradient_direction_radial=\"center\" background_color_gradient_start_position=\"0%\" background_color_gradient_end_position=\"100%\" parallax=\"off\" parallax_method=\"on\" background_size=\"cover\" background_position=\"center\" background_repeat=\"no-repeat\" background_blend=\"normal\" allow_player_pause=\"off\" text_shadow_style=\"none\" box_shadow_style=\"none\" link_option_url_new_window=\"off\" background_color_gradient_overlays_image=\"off\" background_video_pause_outside_viewport=\"on\" text_shadow_horizontal_length=\"0em\" text_shadow_vertical_length=\"0em\" text_shadow_blur_strength=\"0em\" hover_transition_duration=\"300ms\" hover_transition_delay=\"0ms\" hover_transition_speed_curve=\"ease\" box_shadow_horizontal=\"box_shadow_style,%91object Object%93\" box_shadow_vertical=\"box_shadow_style,%91object Object%93\" box_shadow_blur=\"box_shadow_style,%91object Object%93\" box_shadow_spread=\"box_shadow_style,%91object Object%93\"]\r\n\r\n[one_fourth]\r\n\r\n[caption id=\"attachment_13476\" align=\"alignnone\" width=\"214\"]<a href=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2016\/02\/panel-pattern-plating-inpulse-2hf-and-msap-214x300.jpg\"><img class=\"wp-image-41879 size-medium\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2016\/02\/panel-pattern-plating-inpulse-2hf-and-msap-214x300.jpg\" alt=\"Atotech\" width=\"214\" height=\"300\"><\/a> BMV filling in panel and pattern mode (Inpulse<sup>\u00ae<\/sup> 2HF and Inpulse<sup>\u00ae<\/sup> 2MSAP)[\/caption]\r\n\r\n[\/one_fourth][three_fourth_last]\r\n<ul>\r\n \t<li>Horizontal BMV Filling: <strong>Inpulse\u00ae 2HF<\/strong> provides outstanding BMV filling performance (Superfilling\u00ae). Superlative BMV filling results with minimum surface plated copper will be achieved. Thus the use of Inpulse\u00ae 2HF in the unique Uniplate\u00ae InPulse 2 System in combination with the Atotech Fe-redox Cu replenishment system is ideally suited and proven for high end and high volume HDI production. Atotech\u2019s latest development, Inpulse\u00ae 3MSAP, in combination with the new Uniplate\u00ae InPulse 3 equipment offers pattern BMV filling at excellent panel surface distribution. The process is dedicated for (a)mSAP production at highest current densities and provides outstanding rectangular line shape.<\/li>\r\n \t<li>Vertical BMV filling: <strong>InPro\u00ae MVF<\/strong> and <strong>InPro\u00ae MVF2<\/strong> are the VCP processes for current and next generation HDI BMV filling. They are designed for use of insoluble anodes in DC mode and provides excellent pattern BMV filling without dome plating at minimum plated thickness. Our mass production proven InPro\u00ae THF is not only capable for through hole filling but is also a high current density pattern BMV filling process in VCP systems with insoluble anodes. It is the reference for mSAP applications. It's successor InPro\u00ae THF2 offer greater filling capabilities, higher uniformity and increased ductility especially for amSAP production.<\/li>\r\n \t<li><strong>InPro\u00ae SAP3<\/strong> is our latest development for IC Substrate BMV filling in VCP systems with insoluble anodes. This next-generation process enables the highest within-unit distribution. To increase IC Substrate production the high uniformity can be achieved at high applicable current densities. Copper filling performance is uniform in a wide working window to ensure stable and reliable production results for fine line application.<\/li>\r\n \t<li>BMV filling on flex application can be challenging, especially in a case where rolled annealed (RA) copper foil is used. In these cases, it is difficult to achieve a uniform, void-free filling and a bright surface copper appearance because of the RA copper crystal structure. <strong>InPro\u00ae RA<\/strong> provides excellent shininess and reliable filling performance even on half etched RA copper foils and fulfills the industry reliability standards for flex application. It is compatible with VCP, hoist type and reel-to-reel equipment with insoluble anodes and sparger electrolyte agitation.<\/li>\r\n<\/ul>\r\n[\/three_fourth_last]\r\n\r\n[\/et_pb_accordion_item][et_pb_accordion_item title=\"Copper through hole filling\" _builder_version=\"3.22.7\" link_option_url_new_window=\"off\" use_background_color_gradient=\"off\" background_color_gradient_start=\"#2b87da\" background_color_gradient_end=\"#29c4a9\" background_color_gradient_type=\"linear\" background_color_gradient_direction=\"180deg\" background_color_gradient_direction_radial=\"center\" background_color_gradient_start_position=\"0%\" background_color_gradient_end_position=\"100%\" background_color_gradient_overlays_image=\"off\" parallax=\"off\" parallax_method=\"on\" background_size=\"cover\" background_position=\"center\" background_repeat=\"no-repeat\" background_blend=\"normal\" allow_player_pause=\"off\" background_video_pause_outside_viewport=\"on\" text_shadow_style=\"none\" box_shadow_style=\"none\" hover_transition_duration=\"300ms\" hover_transition_delay=\"0ms\" hover_transition_speed_curve=\"ease\" text_shadow_horizontal_length=\"0em\" text_shadow_vertical_length=\"0em\" text_shadow_blur_strength=\"0em\"]\r\n\r\n[one_fourth]\r\n\r\n[caption id=\"attachment_4387\" align=\"alignleft\" width=\"238\"]<img class=\"wp-image-39553 size-medium\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2016\/05\/panel-pattern-plating-inclusion-free-through-hole-238x300.jpg\" alt=\"Atotech\" width=\"238\" height=\"300\"> Laser drilled , inclusion-free through hole: Diameter 100 \u00b5m, panel thickness 0.2mm, plated Cu 15 \u00b5m[\/caption]\r\n\r\n[\/one_fourth][three_fourth_last]\r\n<ul>\r\n \t<li><strong>Inpulse<sup>\u00ae<\/sup> 2THF<\/strong> together with the unique Uniplate<sup>\u00ae<\/sup> InPulse 2 horizontal reverse pulse plating systems is ideally suited for through hole filling , especially for core material with a copper foil of less than 5 \u00b5m thickness. Inpulse<sup>\u00ae<\/sup> 2THF grants reliable and inclusion-free copper through hole filling combining patented X-plating and Superfilling<sup>\u00ae<\/sup> technology in one process chemistry achieving lowest possible surface thickness.<\/li>\r\n \t<li><strong>InPro\u00ae THF<\/strong> is a filling electrolyte for laser ablated through holes (LTH) in VCP facilities for IC Substrate production. The DC plating process is running in mass production in VCP equipment worldwide. It's successor <strong>InPro THF2<\/strong> offers increased filling performance and uniformity. Both may also be used for pattern BMV filling at highest current densities for (a)mSAP production.<\/li>\r\n<\/ul>\r\n[\/three_fourth_last]\r\n\r\n[\/et_pb_accordion_item][et_pb_accordion_item title=\"Electroytic finish\" _builder_version=\"3.22.7\" use_background_color_gradient=\"off\" background_color_gradient_start=\"#2b87da\" background_color_gradient_end=\"#29c4a9\" background_color_gradient_type=\"linear\" background_color_gradient_direction=\"180deg\" background_color_gradient_direction_radial=\"center\" background_color_gradient_start_position=\"0%\" background_color_gradient_end_position=\"100%\" background_color_gradient_overlays_image=\"off\" parallax=\"off\" parallax_method=\"on\" background_size=\"cover\" background_position=\"center\" background_repeat=\"no-repeat\" background_blend=\"normal\" allow_player_pause=\"off\" background_video_pause_outside_viewport=\"on\" text_shadow_style=\"none\" box_shadow_style=\"none\" link_option_url_new_window=\"off\" text_shadow_horizontal_length=\"0em\" text_shadow_vertical_length=\"0em\" text_shadow_blur_strength=\"0em\" hover_transition_duration=\"300ms\" hover_transition_delay=\"0ms\" hover_transition_speed_curve=\"ease\"]\r\n\r\n[one_fourth]\r\n\r\n[caption id=\"attachment_4388\" align=\"alignleft\" width=\"250\"]<img class=\"wp-image-4388 size-full\" src=\"\/wp-content\/uploads\/2016\/05\/panel-pattern-plating-solderfill.jpg\" alt=\"Atotech\" width=\"250\" height=\"134\"> SolderFill for filling of smallest SRO\u2019s[\/caption]\r\n\r\n[\/one_fourth] [three_fourth_last]\r\n<ul>\r\n \t<li><strong>Nikotron<sup>\u00ae<\/sup><\/strong>: Assures a soft, ductile and low internal stress nickel deposits. Stress level and hardness can be controlled.<\/li>\r\n \t<li><strong>Aurotron<sup>\u00ae<\/sup><\/strong>: An electrolytic gold plating for wire bonding and soldering as well as for hard gold applications.<\/li>\r\n \t<li><strong>Pallatron<\/strong>: Provides an electrolytic palladium deposition for higher reliability and reduces costs for Ni\/Pd\/Au applications.<\/li>\r\n \t<li><strong>SolderFill<sup>\u00ae<\/sup><\/strong>: A high-speed Electrolytic Tin Solder Depot Plating which overcomes the limitations of solder paste printing and Micro-ball placement.<\/li>\r\n \t<li><strong>StannoBond<sup>\u00ae<\/sup><\/strong>: An electrolytic tin plating process for Solder on Copper Pillar and for Thermo Compression Bonding.<\/li>\r\n<\/ul>\r\n[\/three_fourth_last]\r\n\r\n[\/et_pb_accordion_item][et_pb_accordion_item title=\"RDL and Pillar plating\" _builder_version=\"3.22.7\" use_background_color_gradient=\"off\" background_color_gradient_start=\"#2b87da\" background_color_gradient_end=\"#29c4a9\" background_color_gradient_type=\"linear\" background_color_gradient_direction=\"180deg\" background_color_gradient_direction_radial=\"center\" background_color_gradient_start_position=\"0%\" background_color_gradient_end_position=\"100%\" background_color_gradient_overlays_image=\"off\" parallax=\"off\" parallax_method=\"on\" background_size=\"cover\" background_position=\"center\" background_repeat=\"no-repeat\" background_blend=\"normal\" allow_player_pause=\"off\" background_video_pause_outside_viewport=\"on\" text_shadow_style=\"none\" box_shadow_style=\"none\" link_option_url_new_window=\"off\" text_shadow_horizontal_length=\"0em\" text_shadow_vertical_length=\"0em\" text_shadow_blur_strength=\"0em\" hover_transition_duration=\"300ms\" hover_transition_delay=\"0ms\" hover_transition_speed_curve=\"ease\"]\r\n\r\n[one_fourth]\r\n\r\n<img class=\"alignnone wp-image-39597 size-full\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2016\/02\/equipment-highlight-multiplate.jpg\" alt=\"Atotech\" width=\"300\" height=\"300\">\r\n\r\n[\/one_fourth] [three_fourth_last]\r\n<ul>\r\n \t<li>The new <strong>Innolyte\u00ae product family<\/strong> for electrolytic plating is paired with an innovative equipment technology for electroplating, the MultiPlate\u00ae. Our high purity Innolyte\u00ae chemistries are designed to plate RDL structures and pillars at highest current densities while achieving excellent uniformity of the plated structures. The plated copper is of high Cu purity to ensure highest copper properties and reliability.\r\n<\/li>\r\n<\/ul>\r\n[\/three_fourth_last]\r\n\r\n[\/et_pb_accordion_item][et_pb_accordion_item title=\"Pretreatment\" _builder_version=\"3.22.7\" link_option_url_new_window=\"off\" use_background_color_gradient=\"off\" background_color_gradient_start=\"#2b87da\" background_color_gradient_end=\"#29c4a9\" background_color_gradient_type=\"linear\" background_color_gradient_direction=\"180deg\" background_color_gradient_direction_radial=\"center\" background_color_gradient_start_position=\"0%\" background_color_gradient_end_position=\"100%\" background_color_gradient_overlays_image=\"off\" parallax=\"off\" parallax_method=\"on\" background_size=\"cover\" background_position=\"center\" background_repeat=\"no-repeat\" background_blend=\"normal\" allow_player_pause=\"off\" background_video_pause_outside_viewport=\"on\" text_shadow_style=\"none\" box_shadow_style=\"none\" hover_transition_duration=\"300ms\" hover_transition_delay=\"0ms\" hover_transition_speed_curve=\"ease\"]\r\n\r\n[one_fourth]\r\n\r\n[caption id=\"attachment_4389\" align=\"alignleft\" width=\"250\"]<img class=\"wp-image-4389 size-full\" src=\"\/wp-content\/uploads\/2016\/05\/panel-pattern-plating-pretreatment.jpg\" alt=\"Atotech\" width=\"250\" height=\"164\"> Cleaning for 3 min at 35 \u00b0C: no attack and no dry film lift off[\/caption]\r\n\r\n[\/one_fourth] [three_fourth_last]\r\n<ul>\r\n \t<li><strong>CupraPro<sup>\u00ae<\/sup> S8<\/strong>: A biodegradable pre-treatment for all HDI panel and pattern copper plating applications. It grants excellent cleaning and also low dynamic surface tension for optimum wetting with reduced drag out.<\/li>\r\n \t<li><strong>CupraPro<sup>\u00ae<\/sup> MV<\/strong>: A biodegradable pre-treatment product for IC Substrate plating applications, specifically developed for use in vertical hoist type equipment. It is NPE free and grants fast, effective pre-treatment through its low dynamic surface tension for via filling applications with reduced drag out.<\/li>\r\n \t<li><strong>CupraPro<sup>\u00ae<\/sup> VC<\/strong>: A new acid pre-treatment product for all panel and pattern copper plating applications, specifically developed for use in vertical conveyorized equipment. It grants low foaming in turbulent fluid environments and rapid, effective wetting of all structures, especially high aspect ratio through holes and BMVs.<\/li>\r\n<\/ul>\r\n[\/three_fourth_last]\r\n\r\n[\/et_pb_accordion_item][\/et_pb_accordion][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section bb_built=\"1\" admin_label=\"section\" specialty=\"off\" parallax_method=\"off\" module_class=\"atotech-recommended-products background-4\" custom_padding_tablet=\"50px|0|50px|0\" custom_padding_last_edited=\"on|desktop\" prev_background_color=\"#000000\" next_background_color=\"#000000\" _builder_version=\"3.17.6\" border_color_bottom=\"#5c94d4\" inner_width=\"auto\" inner_max_width=\"none\"][et_pb_row][et_pb_column type=\"4_4\"][et_pb_text admin_label=\"H2:Featured products\" _builder_version=\"3.17.6\" header_text_color=\"#e02b20\" text_text_color=\"#e02b20\"]\r\n\r\n<h2 style=\"text-align: left;\">Featured products<\/h2>\r\n\r\n[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row admin_label=\"row\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" width=\"80%\" max_width=\"1080px\"][et_pb_column type=\"1_2\"][et_pb_blurb admin_label=\"InPro\u00ae THF \/ THF 2\" title=\"InPro<sup>\u00ae<\/sup> THF \/ InPro<sup>\u00ae<\/sup> THF2\" image=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/05\/th-filled-square.jpg\" icon_placement=\"left\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" _builder_version=\"3.17.6\" max_width_tablet=\"50px\" link_option_url=\"\/inpro-thf\/\"]\r\n\r\n<p>Panel\/pattern via filling in VCP using insoluble anodes for (a)mSAP<\/p>\r\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"https:\/\/www.atotech.com\/products\/electronics\/electrolytic-plating\/inpro-thf\/\">Read more<\/a><\/p>\r\n\r\n[\/et_pb_blurb][et_pb_code admin_label=\"Abstand\"]<br><br>[\/et_pb_code][et_pb_blurb admin_label=\"InPro<sup>\u00ae<\/sup> MVF \/ InPro<sup>\u00ae<\/sup> MVF2\" title=\"InPro<sup>\u00ae<\/sup> MVF \/ InPro<sup>\u00ae<\/sup> MVF2\" image=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/InPro-MVF-InPro-MVF2-teaser.jpg\" icon_placement=\"left\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" _builder_version=\"3.17.6\" max_width_tablet=\"50px\" link_option_url=\"\/inpro-mvf-inpro-mvf2\/\"]\r\n\r\n<p>Excellent filling results for next gen. HDI, flex and Automotive production<\/p>\r\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"inpro-mvf-inpro-mvf2\">Read more<\/a><\/p>\r\n\r\n[\/et_pb_blurb][\/et_pb_column][et_pb_column type=\"1_2\"][et_pb_blurb admin_label=\"Inpulse 2THF\" title=\"Inpulse<sup>\u00ae<\/sup> 2THF\" image=\"\/wp-content\/uploads\/2016\/03\/pp-inpulse-2THF.jpg\" icon_placement=\"left\" use_border_color=\"off\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" _builder_version=\"3.17.6\" max_width_tablet=\"50px\" link_option_url=\"\/inpulse-2thf\/\"]\r\n\r\n<p>Inclusion-free through hole filling with horizontal equipment<\/p>\r\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"inpulse-2thf\">Read more<\/a><\/p>\r\n\r\n[\/et_pb_blurb][et_pb_code admin_label=\"Abstand\"]<br><br>[\/et_pb_code][et_pb_blurb admin_label=\"Cupracid AC\" title=\"Cupracid<sup>\u00ae<\/sup> AC\" image=\"\/wp-content\/uploads\/2016\/02\/Cupracid-AC_BMV-1-bearb.jpg\" icon_placement=\"left\" use_border_color=\"off\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" _builder_version=\"3.17.6\" max_width_tablet=\"50px\" link_option_url=\"\/cupracid-ac\/\"]\r\n\r\n<p>High throw conformal copper plating for MLB and HDI production<\/p>\r\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"cupracid-ac\">Read more<\/a><\/p>\r\n\r\n[\/et_pb_blurb][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section bb_built=\"1\" admin_label=\"section\" fullwidth=\"off\" specialty=\"off\" transparent_background=\"off\" allow_player_pause=\"off\" inner_shadow=\"off\" parallax=\"off\" parallax_method=\"off\" padding_mobile=\"off\" make_fullwidth=\"off\" use_custom_width=\"off\" width_unit=\"on\" make_equal=\"off\" use_custom_gutter=\"off\" gutter_width=\"3\" module_id=\"Systems\" background_color=\"#ffffff\" custom_padding_tablet=\"50px|0|50px|0\" custom_padding_last_edited=\"on|desktop\" prev_background_color=\"#000000\" next_background_color=\"#000000\" inner_width=\"auto\" inner_max_width=\"none\"][et_pb_row background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" _builder_version=\"3.17.6\" width=\"80%\" max_width=\"1080px\"][et_pb_column type=\"1_2\"][et_pb_image src=\"\/wp-content\/uploads\/2016\/02\/PP-Uniplate-InPulse2.jpg\" show_in_lightbox=\"on\" url_new_window=\"off\" animation=\"left\" sticky=\"off\" align=\"left\" force_fullwidth=\"off\" always_center_on_mobile=\"on\" use_border_color=\"off\" border_color=\"#ffffff\" border_style=\"solid\" url=\"\/wp-content\/uploads\/2016\/01\/combined-systems.jpg\" animation_direction=\"left\" animation_style=\"slide\" animation_duration=\"500ms\" animation_intensity_slide=\"10%\" show_bottom_space=\"on\" \/][\/et_pb_column][et_pb_column type=\"1_2\"][et_pb_text admin_label=\"Uniplate InPulse 2\" text_font_size=\"18\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" _builder_version=\"3.17.6\" module_alignment=\"left\"]\r\n\r\n<h2>Uniplate<sup>\u00ae<\/sup> InPulse 2<\/h2>\r\n<h3>Atotech's leading integrated horizontal system for electrolytic copper deposition<\/h3>\r\n<p>The unique Uniplate<sup>\u00ae<\/sup> InPulse 2 System and processes are ideally suited to meet all demands for high end production using pulse plating at high effective current densities with insoluble anodes.<\/p>\r\n<ul>\r\n<li>Inpulse<sup>\u00ae<\/sup> 2HF \u2013 Atotech\u2019s SuperFilling technology allows reliable high volume HDI production of stacked via technology<\/li>\r\n<li>Inpulse<sup>\u00ae<\/sup> 2MSAP \u2013 Atotech\u2019s first horizontal pattern BMV filling process for (a)mSAP production<\/li>\r\n<li>Inpulse<sup>\u00ae<\/sup> 2THF \u2013 a unique process enabling inclusion-free through hole filling with minimum surface plated copper<\/li>\r\n<li>Inpulse<sup>\u00ae<\/sup> 2HFU \u2013 best BMV preparation for subsequent lamination and copper filling within mSAP production processes<\/li>\r\n<\/ul>\r\n<p><a class=\"et_pb_promo_button et_pb_button\" href=\"\/electronics-equipment-technology\/uniplate-ip2-advanced\">Read more<\/a><\/p>\r\n\r\n[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section bb_built=\"1\" admin_label=\"section\" fullwidth=\"off\" specialty=\"off\" transparent_background=\"off\" allow_player_pause=\"off\" inner_shadow=\"off\" parallax=\"off\" parallax_method=\"off\" padding_mobile=\"off\" make_fullwidth=\"off\" use_custom_width=\"off\" width_unit=\"on\" make_equal=\"off\" use_custom_gutter=\"off\" gutter_width=\"3\" module_id=\"Systems\" background_color=\"#ffffff\" custom_padding_tablet=\"50px|0|50px|0\" custom_padding_last_edited=\"on|desktop\" prev_background_color=\"#000000\" next_background_color=\"#000000\" inner_width=\"auto\" inner_max_width=\"none\"][et_pb_row background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" width=\"80%\" max_width=\"1080px\"][et_pb_column type=\"1_2\"][et_pb_text admin_label=\"MultiPlate\u00ae P\" border_style=\"solid\" text_font_size=\"18\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" _builder_version=\"3.22.7\" module_alignment=\"left\" text_text_shadow_horizontal_length=\"text_text_shadow_style,%91object Object%93\" text_text_shadow_vertical_length=\"text_text_shadow_style,%91object Object%93\" text_text_shadow_blur_strength=\"text_text_shadow_style,%91object Object%93\" link_text_shadow_horizontal_length=\"link_text_shadow_style,%91object Object%93\" link_text_shadow_vertical_length=\"link_text_shadow_style,%91object Object%93\" link_text_shadow_blur_strength=\"link_text_shadow_style,%91object Object%93\" ul_text_shadow_horizontal_length=\"ul_text_shadow_style,%91object Object%93\" ul_text_shadow_vertical_length=\"ul_text_shadow_style,%91object Object%93\" ul_text_shadow_blur_strength=\"ul_text_shadow_style,%91object Object%93\" ol_text_shadow_horizontal_length=\"ol_text_shadow_style,%91object Object%93\" ol_text_shadow_vertical_length=\"ol_text_shadow_style,%91object Object%93\" ol_text_shadow_blur_strength=\"ol_text_shadow_style,%91object Object%93\" quote_text_shadow_horizontal_length=\"quote_text_shadow_style,%91object Object%93\" quote_text_shadow_vertical_length=\"quote_text_shadow_style,%91object Object%93\" quote_text_shadow_blur_strength=\"quote_text_shadow_style,%91object Object%93\" header_text_shadow_horizontal_length=\"header_text_shadow_style,%91object Object%93\" header_text_shadow_vertical_length=\"header_text_shadow_style,%91object Object%93\" header_text_shadow_blur_strength=\"header_text_shadow_style,%91object Object%93\" header_2_text_shadow_horizontal_length=\"header_2_text_shadow_style,%91object Object%93\" header_2_text_shadow_vertical_length=\"header_2_text_shadow_style,%91object Object%93\" header_2_text_shadow_blur_strength=\"header_2_text_shadow_style,%91object Object%93\" header_3_text_shadow_horizontal_length=\"header_3_text_shadow_style,%91object Object%93\" header_3_text_shadow_vertical_length=\"header_3_text_shadow_style,%91object Object%93\" header_3_text_shadow_blur_strength=\"header_3_text_shadow_style,%91object Object%93\" header_4_text_shadow_horizontal_length=\"header_4_text_shadow_style,%91object Object%93\" header_4_text_shadow_vertical_length=\"header_4_text_shadow_style,%91object Object%93\" header_4_text_shadow_blur_strength=\"header_4_text_shadow_style,%91object Object%93\" header_5_text_shadow_horizontal_length=\"header_5_text_shadow_style,%91object Object%93\" header_5_text_shadow_vertical_length=\"header_5_text_shadow_style,%91object Object%93\" header_5_text_shadow_blur_strength=\"header_5_text_shadow_style,%91object Object%93\" header_6_text_shadow_horizontal_length=\"header_6_text_shadow_style,%91object Object%93\" header_6_text_shadow_vertical_length=\"header_6_text_shadow_style,%91object Object%93\" header_6_text_shadow_blur_strength=\"header_6_text_shadow_style,%91object Object%93\" z_index_tablet=\"500\"]\r\n\r\n<h2>Multiplate<sup>\u00ae<\/sup> P<\/h2>\r\n<h3>Atotech's solution for next generation packaging technologies<\/h3>\r\n<ul>\r\n<li>MultiPlate\u00ae is the ECD tool that offers the versatility and multifunctionality necessary to tackle current and future challenges for optimal performance in advanced packaging technologies. The MultiPlate\u00ae P system is designed for Panel-Level-Packaging and capable of processing panels up to 650\u00d7610 mm.<\/li>\r\n<li>Innolyte\u00ae PLP - the RDL and via filling process offers excellent distribution and via filling capabilities in combination with an excellent line shape<\/li>\r\n<li>Innolyte\u00ae P - high purity copper pillar plating at current densities up to 20 A\/dm\u00b2 for best uniformity and no voiding in IMC.<\/li>\r\n<\/ul>\r\n\r\n[\/et_pb_text][\/et_pb_column][et_pb_column type=\"1_2\"][et_pb_image src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2018\/12\/Multiplate_P.jpg\" show_in_lightbox=\"on\" animation=\"left\" sticky=\"off\" use_border_color=\"off\" url=\"\/wp-content\/uploads\/2016\/01\/combined-systems.jpg\" animation_direction=\"left\" animation_style=\"slide\" animation_duration=\"500ms\" animation_intensity_slide=\"10%\" _builder_version=\"3.17.6\" \/][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section bb_built=\"1\" admin_label=\"section\" specialty=\"off\" transparent_background=\"off\" parallax_method=\"off\" custom_padding_tablet=\"50px|0|50px|0\" custom_padding_last_edited=\"on|desktop\" disabled_on=\"off|off|off\" disabled=\"off\" _builder_version=\"3.17.6\" prev_background_color=\"#000000\" next_background_color=\"#000000\" border_width_bottom=\"1px\" border_color_bottom=\"#5c94d4\" module_class=\"revamp-quote backgrounds-4\" inner_width=\"auto\" inner_max_width=\"none\"][et_pb_row admin_label=\"row\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" _builder_version=\"3.17.6\" module_class=\"centered-textblock background-1\" width=\"80%\" max_width=\"1080px\"][et_pb_column type=\"1_2\"][et_pb_text admin_label=\"Zitat (Did you know)\" _builder_version=\"3.22.7\" module_class=\"quote-area\" text_text_shadow_horizontal_length=\"text_text_shadow_style,%91object Object%93\" text_text_shadow_vertical_length=\"text_text_shadow_style,%91object Object%93\" text_text_shadow_blur_strength=\"text_text_shadow_style,%91object Object%93\" link_text_shadow_horizontal_length=\"link_text_shadow_style,%91object Object%93\" link_text_shadow_vertical_length=\"link_text_shadow_style,%91object Object%93\" link_text_shadow_blur_strength=\"link_text_shadow_style,%91object Object%93\" ul_text_shadow_horizontal_length=\"ul_text_shadow_style,%91object Object%93\" ul_text_shadow_vertical_length=\"ul_text_shadow_style,%91object Object%93\" ul_text_shadow_blur_strength=\"ul_text_shadow_style,%91object Object%93\" ol_text_shadow_horizontal_length=\"ol_text_shadow_style,%91object Object%93\" ol_text_shadow_vertical_length=\"ol_text_shadow_style,%91object Object%93\" ol_text_shadow_blur_strength=\"ol_text_shadow_style,%91object Object%93\" quote_text_shadow_horizontal_length=\"quote_text_shadow_style,%91object Object%93\" quote_text_shadow_vertical_length=\"quote_text_shadow_style,%91object Object%93\" quote_text_shadow_blur_strength=\"quote_text_shadow_style,%91object Object%93\" header_text_shadow_horizontal_length=\"header_text_shadow_style,%91object Object%93\" header_text_shadow_vertical_length=\"header_text_shadow_style,%91object Object%93\" header_text_shadow_blur_strength=\"header_text_shadow_style,%91object Object%93\" header_2_text_shadow_horizontal_length=\"header_2_text_shadow_style,%91object Object%93\" header_2_text_shadow_vertical_length=\"header_2_text_shadow_style,%91object Object%93\" header_2_text_shadow_blur_strength=\"header_2_text_shadow_style,%91object Object%93\" header_3_text_shadow_horizontal_length=\"header_3_text_shadow_style,%91object Object%93\" header_3_text_shadow_vertical_length=\"header_3_text_shadow_style,%91object Object%93\" header_3_text_shadow_blur_strength=\"header_3_text_shadow_style,%91object Object%93\" header_4_text_shadow_horizontal_length=\"header_4_text_shadow_style,%91object Object%93\" header_4_text_shadow_vertical_length=\"header_4_text_shadow_style,%91object Object%93\" header_4_text_shadow_blur_strength=\"header_4_text_shadow_style,%91object Object%93\" header_5_text_shadow_horizontal_length=\"header_5_text_shadow_style,%91object Object%93\" header_5_text_shadow_vertical_length=\"header_5_text_shadow_style,%91object Object%93\" header_5_text_shadow_blur_strength=\"header_5_text_shadow_style,%91object Object%93\" header_6_text_shadow_horizontal_length=\"header_6_text_shadow_style,%91object Object%93\" header_6_text_shadow_vertical_length=\"header_6_text_shadow_style,%91object Object%93\" header_6_text_shadow_blur_strength=\"header_6_text_shadow_style,%91object Object%93\" z_index_tablet=\"500\"]\r\n\r\n<p>\u201cWe offer cost-efficient solutions to the PCB and FOPLP industry with the full spectrum of applications for electrolytic plating of Cu, Sn, Ni, Pd, Au and suitable pre-treatments. Our portfolio comprises of processes for all types of equipment from horizontal to VCP and hoist type systems.\"<\/p>\r\n\r\n[\/et_pb_text][et_pb_text _builder_version=\"3.22.7\" text_text_shadow_horizontal_length=\"text_text_shadow_style,%91object Object%93\" text_text_shadow_vertical_length=\"text_text_shadow_style,%91object Object%93\" text_text_shadow_blur_strength=\"text_text_shadow_style,%91object Object%93\" link_text_shadow_horizontal_length=\"link_text_shadow_style,%91object Object%93\" link_text_shadow_vertical_length=\"link_text_shadow_style,%91object Object%93\" link_text_shadow_blur_strength=\"link_text_shadow_style,%91object Object%93\" ul_text_shadow_horizontal_length=\"ul_text_shadow_style,%91object Object%93\" ul_text_shadow_vertical_length=\"ul_text_shadow_style,%91object Object%93\" ul_text_shadow_blur_strength=\"ul_text_shadow_style,%91object Object%93\" ol_text_shadow_horizontal_length=\"ol_text_shadow_style,%91object Object%93\" ol_text_shadow_vertical_length=\"ol_text_shadow_style,%91object Object%93\" ol_text_shadow_blur_strength=\"ol_text_shadow_style,%91object Object%93\" quote_text_shadow_horizontal_length=\"quote_text_shadow_style,%91object Object%93\" quote_text_shadow_vertical_length=\"quote_text_shadow_style,%91object Object%93\" quote_text_shadow_blur_strength=\"quote_text_shadow_style,%91object Object%93\" header_text_shadow_horizontal_length=\"header_text_shadow_style,%91object Object%93\" header_text_shadow_vertical_length=\"header_text_shadow_style,%91object Object%93\" header_text_shadow_blur_strength=\"header_text_shadow_style,%91object Object%93\" header_2_text_shadow_horizontal_length=\"header_2_text_shadow_style,%91object Object%93\" header_2_text_shadow_vertical_length=\"header_2_text_shadow_style,%91object Object%93\" header_2_text_shadow_blur_strength=\"header_2_text_shadow_style,%91object Object%93\" header_3_text_shadow_horizontal_length=\"header_3_text_shadow_style,%91object Object%93\" header_3_text_shadow_vertical_length=\"header_3_text_shadow_style,%91object Object%93\" header_3_text_shadow_blur_strength=\"header_3_text_shadow_style,%91object Object%93\" header_4_text_shadow_horizontal_length=\"header_4_text_shadow_style,%91object Object%93\" header_4_text_shadow_vertical_length=\"header_4_text_shadow_style,%91object Object%93\" header_4_text_shadow_blur_strength=\"header_4_text_shadow_style,%91object Object%93\" header_5_text_shadow_horizontal_length=\"header_5_text_shadow_style,%91object Object%93\" header_5_text_shadow_vertical_length=\"header_5_text_shadow_style,%91object Object%93\" header_5_text_shadow_blur_strength=\"header_5_text_shadow_style,%91object Object%93\" header_6_text_shadow_horizontal_length=\"header_6_text_shadow_style,%91object Object%93\" header_6_text_shadow_vertical_length=\"header_6_text_shadow_style,%91object Object%93\" header_6_text_shadow_blur_strength=\"header_6_text_shadow_style,%91object Object%93\" z_index_tablet=\"500\"]\r\n\r\n<p>Bert Reents<br> Global Product Director Electrolytic Plating at Atotech Germany<\/p>\r\n\r\n[\/et_pb_text][\/et_pb_column][et_pb_column type=\"1_2\"][et_pb_image _builder_version=\"3.22.7\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/08\/reents_8565_klein.jpg\" z_index_tablet=\"500\" \/][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section bb_built=\"1\" admin_label=\"section\" specialty=\"off\" parallax_method=\"off\" module_class=\"blurb-list background-4\" custom_padding=\"||100px|\" custom_padding_tablet=\"50px|0|50px|0\" custom_padding_last_edited=\"on|desktop\" prev_background_color=\"#000000\" _builder_version=\"3.17.6\" next_background_color=\"#000000\" border_color_bottom=\"#5c94d4\" inner_width=\"auto\" inner_max_width=\"none\"][et_pb_row _builder_version=\"3.17.6\" width=\"80%\" max_width=\"1080px\"][et_pb_column type=\"4_4\"][et_pb_text admin_label=\"H2: Recent publications\" _builder_version=\"3.17.6\" header_text_color=\"#e02b20\" text_text_color=\"#e02b20\"]\r\n\r\n<h2 style=\"text-align: left;\">Recent publications<\/h2>\r\n\r\n[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row][et_pb_column type=\"1_2\"][et_pb_blurb admin_label=\"Filling of Microvias and Through Holes by Electrolytic Copper Plating \u2013 Current Status and Future Outlook\" url_new_window=\"on\" use_icon=\"on\" font_icon=\"%%71%%\" circle_color=\"#7EBEC5\" circle_border_color=\"#7EBEC5\" icon_placement=\"left\" image=\"\/wp-content\/uploads\/2015\/11\/downloads02.png\" header_text_color=\"#5992d6\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" _builder_version=\"3.22.7\" max_width_tablet=\"50px\" title=\"Filling of Microvias and Through Holes by Electrolytic Copper Plating \u2013 Current Status and Future Outlook\" icon_color=\"#5992d6\" url=\"\/wp-content\/uploads\/2019\/03\/IPC_APEX_2019_Filling-of-BMVs-and-THs-by-Electrolytic-Copper-Plating.pdf\"]\r\n\r\n<p>\r\nThis article was created in cooperation with GreenSource Fabrication LLC., USA and was originally presented on IPC APEX EXPO 2019. The paper describes the reasons for development of copper via filling and a roadmap of dimensions for copper filled through holes, microvias and showing aspects of other copper plated structures on PCBs. Furthermore, it contains feasibility studies of new electroplated structures for future applications such as copper pillar plating on IC-substrates.<\/p>\r\n<p>2019, PDF, 540 KB<\/p>\r\n\r\n[\/et_pb_blurb][\/et_pb_column][et_pb_column type=\"1_2\"][et_pb_blurb admin_label=\"Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost\" url=\"\/wp-content\/uploads\/2019\/03\/2018-09-14_IMAPS2018_Upscaling-panel-size-for-Cu-plating-on-FOPLP-applications-to-reduce-manufacturing_rev.pdf\" url_new_window=\"on\" use_icon=\"on\" font_icon=\"%%71%%\" icon_color=\"#ffffff\" icon_placement=\"left\" image=\"\/wp-content\/uploads\/2015\/11\/downloads02.png\" header_text_color=\"#5992d6\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" _builder_version=\"3.22.7\" max_width_tablet=\"50px\" title=\"Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost\" text_shadow_horizontal_length=\"text_shadow_style,%91object Object%93\" text_shadow_vertical_length=\"text_shadow_style,%91object Object%93\" text_shadow_blur_strength=\"text_shadow_style,%91object Object%93\" header_text_shadow_horizontal_length=\"header_text_shadow_style,%91object Object%93\" header_text_shadow_vertical_length=\"header_text_shadow_style,%91object Object%93\" header_text_shadow_blur_strength=\"header_text_shadow_style,%91object Object%93\" body_text_shadow_horizontal_length=\"body_text_shadow_style,%91object Object%93\" body_text_shadow_vertical_length=\"body_text_shadow_style,%91object Object%93\" body_text_shadow_blur_strength=\"body_text_shadow_style,%91object Object%93\" z_index_tablet=\"500\"]\r\n\r\n<p>The ever increasing demand of higher performance, lower cost and thinner end user devices like smartphones require intense developments and innovation in all areas of the electronic component design including the substrate and chip packaging. Latest manufacturing technologies in both areas like fan-out wafer level packaging and advanced substrates are constantly emerging and promise to be a critical piece to meet these requirements. The paper presents latest studies and conclusions in critical performance areas of the plating process such as electrolyte fluid dynamics, impact of anode design, pulse reverse rectification and newly designed electrolytes on panel sizes of up to 600 mm.<br \/>\r\nThis article was originally published on IMAPS 2018, Pasadena.<\/p>\r\n<p>2018, PDF, 900 KB<\/p>\r\n\r\n[\/et_pb_blurb][\/et_pb_column][\/et_pb_row][et_pb_row][et_pb_column type=\"1_2\"][et_pb_blurb admin_label=\"Enhancing Productivity for IC-substrate manufacturing by using a novel Copper Electrolyte for Semi Additive Plating\" url_new_window=\"on\" use_icon=\"on\" font_icon=\"%%71%%\" icon_placement=\"left\" image=\"\/wp-content\/uploads\/2015\/11\/downloads02.png\" header_text_color=\"#5992d6\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" _builder_version=\"3.22.7\" max_width_tablet=\"50px\" title=\"Enhancing Productivity for IC-substrate manufacturing by using a novel Copper Electrolyte for Semi Additive Plating\" icon_color=\"#5992d6\" url=\"\/wp-content\/uploads\/2019\/03\/2018-10_EPTC-Sigapore_novel-Copper-Electrolyte-for-SAP.pdf\" text_shadow_horizontal_length=\"text_shadow_style,%91object Object%93\" text_shadow_vertical_length=\"text_shadow_style,%91object Object%93\" text_shadow_blur_strength=\"text_shadow_style,%91object Object%93\" header_text_shadow_horizontal_length=\"header_text_shadow_style,%91object Object%93\" header_text_shadow_vertical_length=\"header_text_shadow_style,%91object Object%93\" header_text_shadow_blur_strength=\"header_text_shadow_style,%91object Object%93\" body_text_shadow_horizontal_length=\"body_text_shadow_style,%91object Object%93\" body_text_shadow_vertical_length=\"body_text_shadow_style,%91object Object%93\" body_text_shadow_blur_strength=\"body_text_shadow_style,%91object Object%93\" z_index_tablet=\"500\"]\r\n\r\n<p>\r\nThe Semi Additive Process (SAP) has gained more attraction over the past years because it enables very fine lines and spaces for the production of IC-substrates. When operating with lines and spaces (L\/S) of 10\/10 \u03bcm and less, the copper thickness variation is one of the critical parameters which has to be controlled within a tight range in order to avoid reliability problems in assembly or during the lifetime. This paper contains the results of our investigations on our latest via filling process for IC-substrates with regards to copper thickness variation (WUD), dimple results, filling performance and microsection pictures.<br \/>\r\nThis article was originally published on EPTC 2018, Singapore.<\/p>\r\n<p>2018, PDF, 320 KB<\/p>\r\n\r\n[\/et_pb_blurb][\/et_pb_column][et_pb_column type=\"1_2\"][et_pb_blurb admin_label=\"Fine line through hole copper filling in VCP for next generation packaging\" url_new_window=\"on\" use_icon=\"on\" font_icon=\"%%71%%\" icon_placement=\"left\" image=\"\/wp-content\/uploads\/2015\/11\/downloads02.png\" header_text_color=\"#5992d6\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" _builder_version=\"3.22.7\" max_width_tablet=\"50px\" title=\"Fine line through hole copper filling in VCP for next generation packaging\" icon_color=\"#5992d6\" url=\"\/wp-content\/uploads\/2019\/03\/2017_SMTA_Fine-line-TH-copper-filling-in-VCP-for-next-gen.-packaging.pdf\" text_shadow_horizontal_length=\"text_shadow_style,%91object Object%93\" text_shadow_vertical_length=\"text_shadow_style,%91object Object%93\" text_shadow_blur_strength=\"text_shadow_style,%91object Object%93\" header_text_shadow_horizontal_length=\"header_text_shadow_style,%91object Object%93\" header_text_shadow_vertical_length=\"header_text_shadow_style,%91object Object%93\" header_text_shadow_blur_strength=\"header_text_shadow_style,%91object Object%93\" body_text_shadow_horizontal_length=\"body_text_shadow_style,%91object Object%93\" body_text_shadow_vertical_length=\"body_text_shadow_style,%91object Object%93\" body_text_shadow_blur_strength=\"body_text_shadow_style,%91object Object%93\" z_index_tablet=\"500\"]\r\n\r\n<p>\r\nThis paper presents the complete through hole filling for cores using a Cu electroplating process for IC Package production, especially for FC-BGA and FC-CSP. In detail the influence of electrolyte agitation, current density, inorganic and organic concentrations on the filling performance are described and discussed. The result of our investigations is a process with improved TH filling capability at low void occurrence and excellent within-unit distribution.<br \/>\r\nThe article was originally published on SMTA 2017, Chicago.<\/p>\r\n<p>2017, PDF, 510 KB<\/p>\r\n\r\n[\/et_pb_blurb][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section bb_built=\"1\" prev_background_color=\"#000000\" next_background_color=\"#000000\" _builder_version=\"3.17.6\" module_class=\"portfolio-grid\" inner_width=\"auto\" inner_max_width=\"none\"][et_pb_row _builder_version=\"3.17.6\" module_id=\"portfolio\" width=\"80%\" max_width=\"1080px\"][et_pb_column type=\"2_3\"][et_pb_text admin_label=\"Portfolio overview\" _builder_version=\"3.17.6\"]\r\n\r\n<h2>Electronics portfolio overview<\/h2>\r\n\r\n[\/et_pb_text][\/et_pb_column][et_pb_column type=\"1_3\"][\/et_pb_column][\/et_pb_row][et_pb_row admin_label=\"row\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" _builder_version=\"3.17.6\" width=\"80%\" max_width=\"1080px\"][et_pb_column type=\"1_4\"][et_pb_image admin_label=\"Image Surface treatment\" _builder_version=\"3.17.6\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-surface-treatment.jpg\" url=\"https:\/\/www.atotech.com\/products\/electronics\/surface-treatment\/\" \/][et_pb_text admin_label=\"Link Surface treatment\" _builder_version=\"3.17.6\" custom_margin=\"-10px|||\"]\r\n\r\n<p>\r\n[button link=\"https:\/\/www.atotech.com\/products\/electronics\/surface-treatment\/\"]Surface treatment[\/button]<\/p>\r\n\r\n[\/et_pb_text][\/et_pb_column][et_pb_column type=\"1_4\"][et_pb_image admin_label=\"Image Desmear and metallization\" _builder_version=\"3.17.6\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-desmear-and-metallization.jpg\" url=\"https:\/\/www.atotech.com\/products\/electronics\/desmear-and-metallization\/\" \/][et_pb_text admin_label=\"Link Desmear and metallization\" _builder_version=\"3.17.6\" custom_margin=\"-10px|||\"]\r\n\r\n<p>\r\n[button link=\"https:\/\/www.atotech.com\/products\/electronics\/desmear-and-metallization\/\"]Desmear and metallization[\/button]<\/p>\r\n\r\n[\/et_pb_text][\/et_pb_column][et_pb_column type=\"1_4\"][et_pb_image admin_label=\"Image Final finishing\" _builder_version=\"3.17.6\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-final-finishing.jpg\" url=\"https:\/\/www.atotech.com\/products\/electronics\/final-finishing\/\" \/][et_pb_text admin_label=\"Link Final finishing\" _builder_version=\"3.17.6\" custom_margin=\"-10px|||\"]\r\n\r\n<p>\r\n[button link=\"https:\/\/www.atotech.com\/products\/electronics\/final-finishing\/\"]Final finishing[\/button]<\/p>\r\n\r\n[\/et_pb_text][\/et_pb_column][et_pb_column type=\"1_4\"][et_pb_image admin_label=\"Image Leadframe and connector\" _builder_version=\"3.17.6\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-leadframe-and-connector.jpg\" url=\"https:\/\/www.atotech.com\/products\/electronics\/leadframe-and-connector\/\" \/][et_pb_text admin_label=\"Link Leadframe and connector\" _builder_version=\"3.17.6\"]\r\n\r\n<p>\r\n[button link=\"https:\/\/www.atotech.com\/products\/electronics\/leadframe-and-connector\/\"]Leadframe and connector[\/button]<\/p>\r\n\r\n[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row][et_pb_column type=\"1_4\"][et_pb_image admin_label=\"Image Semiconductor\" _builder_version=\"3.17.6\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-sc.jpg\" url=\"https:\/\/www.atotech.com\/products\/electronics\/semiconductor\/\" \/][et_pb_text admin_label=\"Link Semiconductor\" _builder_version=\"3.17.6\"]\r\n\r\n<p>\r\n[button link=\"https:\/\/www.atotech.com\/products\/electronics\/semiconductor\/\"]Semiconductor[\/button]<\/p>\r\n<p>\u00a0<\/p>\r\n\r\n[\/et_pb_text][\/et_pb_column][et_pb_column type=\"1_4\"][et_pb_image admin_label=\"Image Equipment\" _builder_version=\"3.17.6\" src=\"https:\/\/www.atotech.com\/wp-content\/uploads\/2019\/03\/el-intro-equipment.jpg\" url=\"https:\/\/www.atotech.com\/products\/electronics\/electronics-equipment\/\" \/][et_pb_text admin_label=\"Link Equipment\" _builder_version=\"3.17.6\"]\r\n\r\n<p>\r\n[button link=\"https:\/\/www.atotech.com\/products\/electronics\/electronics-equipment\/\"]Equipment[\/button]<\/p>\r\n<p>\u00a0<\/p>\r\n\r\n[\/et_pb_text][\/et_pb_column][et_pb_column type=\"1_4\"][\/et_pb_column][et_pb_column type=\"1_4\"][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section bb_built=\"1\" admin_label=\"section\" fullwidth=\"off\" specialty=\"off\" transparent_background=\"off\" allow_player_pause=\"off\" inner_shadow=\"off\" parallax=\"off\" parallax_method=\"off\" padding_mobile=\"off\" make_fullwidth=\"off\" use_custom_width=\"off\" width_unit=\"on\" make_equal=\"off\" use_custom_gutter=\"off\" gutter_width=\"3\" custom_padding_tablet=\"50px|0|50px|0\" custom_padding_last_edited=\"on|desktop\" prev_background_color=\"#ffffff\" next_background_color=\"#ffffff\" disabled_on=\"on|on|on\" disabled=\"on\" inner_width=\"auto\" inner_max_width=\"none\"][et_pb_row admin_label=\"row\" make_fullwidth=\"off\" use_custom_width=\"off\" width_unit=\"on\" use_custom_gutter=\"off\" gutter_width=\"3\" padding_mobile=\"off\" allow_player_pause=\"off\" parallax=\"off\" parallax_method=\"off\" make_equal=\"off\" parallax_1=\"off\" parallax_method_1=\"off\" column_padding_mobile=\"on\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" width=\"80%\" max_width=\"1080px\"][et_pb_column type=\"4_4\"][et_pb_text admin_label=\"Image Gallery\" background_layout=\"light\" text_orientation=\"center\" use_border_color=\"off\" border_color=\"#ffffff\" border_style=\"solid\" text_font_size=\"14\" custom_padding=\"0px||0px|\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" module_alignment=\"center\"]\r\n\r\n<h2>Image gallery<\/h2>\r\n\r\n[\/et_pb_text][et_pb_gallery gallery_ids=\"4351,5205,5204,5321,5533,4387,4461,5528\" fullwidth=\"off\" show_title_and_caption=\"on\" show_pagination=\"on\" background_layout=\"light\" auto=\"off\" hover_overlay_color=\"rgba(255,255,255,0.9)\" caption_all_caps=\"off\" use_border_color=\"off\" border_color=\"#ffffff\" border_style=\"solid\" posts_number=\"8\" caption_font_size=\"14\" title_font_size=\"16\" \/][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section bb_built=\"1\" fullwidth=\"off\" specialty=\"off\" transparent_background=\"off\" allow_player_pause=\"off\" inner_shadow=\"off\" parallax=\"off\" parallax_method=\"off\" padding_mobile=\"off\" module_id=\"contact\" make_fullwidth=\"off\" use_custom_width=\"off\" width_unit=\"on\" make_equal=\"off\" use_custom_gutter=\"off\" gutter_width=\"3\" custom_padding_tablet=\"50px|0|50px|0\" custom_padding_last_edited=\"on|desktop\" prev_background_color=\"#ffffff\" next_background_color=\"#000000\" inner_width=\"auto\" inner_max_width=\"none\"][et_pb_row background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" width=\"80%\" max_width=\"1080px\"][et_pb_column type=\"4_4\"][et_pb_text admin_label=\"Contact Us EL\" use_border_color=\"off\" background_position=\"top_left\" background_repeat=\"repeat\" background_size=\"initial\" module_alignment=\"center\" _builder_version=\"3.17.6\"]\r\n\r\n<h2 style=\"text-align: left;\">Contact Us<\/h2>\r\n<p>[contact-form-7 id=\"3709\" title=\"Contact EL\"]<\/p>\r\n\r\n[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section]","_et_gb_content_width":"","iawp_total_views":490,"footnotes":""},"class_list":["post-51269","page","type-page","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.atotech.com\/de\/wp-json\/wp\/v2\/pages\/51269","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.atotech.com\/de\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.atotech.com\/de\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/de\/wp-json\/wp\/v2\/users\/4"}],"replies":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/de\/wp-json\/wp\/v2\/comments?post=51269"}],"version-history":[{"count":24,"href":"https:\/\/www.atotech.com\/de\/wp-json\/wp\/v2\/pages\/51269\/revisions"}],"predecessor-version":[{"id":117269,"href":"https:\/\/www.atotech.com\/de\/wp-json\/wp\/v2\/pages\/51269\/revisions\/117269"}],"up":[{"embeddable":true,"href":"https:\/\/www.atotech.com\/de\/wp-json\/wp\/v2\/pages\/46889"}],"wp:attachment":[{"href":"https:\/\/www.atotech.com\/de\/wp-json\/wp\/v2\/media?parent=51269"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}