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Berlin, October 9, 2020 –<\/strong> Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for PCB, semiconductor advanced packaging and dual damascene applications, will present at this year\u2019s IWLPC. The on-demand conference and expo will be held from October 13th through 30th.<\/p>\n Atotech\u2019s expert, Roger Massey, will give a technical paper presentation entitled \u201cHydrogen embrittlement and nano void classification within electroless copper depositions\u201d. His presentation is part of the 3D Integration track and will be available for viewing during the entire time the conference is open. Attendees of this virtually held conference are invited to watch Mr. Massey\u2019s presentation.<\/p>\n Date:<\/strong><\/span> October 13 through 30, 2020<\/p>\n For more information, please visit: https:\/\/smta.org\/mpage\/iwlpc-home<\/a><\/p>\n
\nConference:<\/strong><\/span> 17th International Wafer-Level Packaging Conference 2020<\/p>\n