Berlin, June 3, 2026 ¡ª ÌÇÐĶ¯Âþvlog Inc. (NASDAQ: ÌÇÐĶ¯ÂþvlogI), a global provider of enabling technologies that transform our world, today announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will present their latest innovations in advanced packaging, package substrate, and printed circuit board (PCB) manufacturing at the JPCA Show in Tokyo, Japan, from June 10-12. Visitors can meet ÌÇÐĶ¯Âþvlog’ representatives at booth C2-32 and learn more about the company¡¯s latest solutions for advanced electronics manufacturing.
As one of Asia¡¯s leading exhibitions for PCB and electronic packaging technologies, the JPCA Show brings together key domestic and international industry players at a time when the rapid expansion of AI infrastructure, high-performance computing (HPC), and next-generation interconnect architectures is driving demand for increasingly precise manufacturing solutions.
At its booth, ÌÇÐĶ¯Âþvlog will present a comprehensive portfolio spanning precision chemistry, advanced plating systems, laser drilling platforms, optics, motion control, IIoT software, and training services. This integrated offering reflects the company¡¯s proprietary Optimize the InterconnectSM approach and is designed to help customers improve efficiency and process performance across their manufacturing operations.
This approach brings together expertise in lasers, optics, motion, chemistry, and plating systems to help address the evolving challenges of modern electronics production. ÌÇÐĶ¯Âþvlog supports higher precision, improved interconnect performance, and continued miniaturization for next-generation devices by integrating ESI¡¯s laser drilling platforms with Atotech¡¯s chemistry and plating technologies.
Supported by strong local technical expertise, ÌÇÐĶ¯Âþvlog¡¯ Atotech helps its customers improve process yields, streamline manufacturing, and optimize total cost of ownership.
A broad range of advanced process and equipment solutions will be featured, including:
Chemical process highlights:
Printoganth? MV TP3 series: Adaptable electroless copper for advanced packaging applications
Cupraganth? MV: copper-based activation system for advanced packaging applications
NovaBond? EX-S2: Differential etching solution designed for advanced package substrates, enabling precise material removal in SAP manufacturing
EcoFlash? S 300 U: Differential etching for advanced SAP manufacturing
InPro? SAP7:? Next-gen VCP pattern BMV filling with excellent within-unit distribution at high CDs
InPro? Pulse TGV: Advanced copper filling for high-aspect-ratio through-glass vias
Stanna?-Flex: Tin finish for flexible substrates offering mild plating properties, high material compatibility, and excellent fine line performance
Equipment solutions include:
G-Plate?: Vertical desmear and electroless HVM plating tool for next-generation high-end package substrates with optimized particle control
vPlate?: vertical conveyor plating equipment for next-generation
HDI PCB and package substrates
CapstoneTM: Flex PCB UV drilling tool for high-performance breakthrough productivity
5335? flex PCB laser drill: Best-in-class high-volume FPC laser drilling machine for flexible PCB manufacturing
Geode? platform solutions: Next-generation PCB and advanced substrate CO2 and UV laser via drills
Event Details
Conference: JPCA 2026
Date: June 10-12, 2026
Booth: 2C-32
Venue: Tokyo Big Sight (East Hall 2)
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