Ag O-56
A pure silver plating process that delivers semi-bright to bright silver deposits with high purity, low contact resistance, and adjustable deposit properties.
Highest purity
Provides pure silver deposits classified as Type 1, Grade A according to ASTM B700.
Low contact resistance
Supports reliable electronic performance with low contact resistance of 1.7 ?¦¸/cm.
Versatile application
Can be tailored to specific production needs by adjusting additives for brightness and deposit characteristics.
Ag O-56 is a cyanide-based, semi-bright silver plating process developed for applications where high-purity silver deposits and stable electrical performance are required. The process contains multiple additives that allow the deposit properties to be tailored to customer-specific requirements, including adjustable brightness and hardness.
The deposits achieve a hardness of 80 HV and maintain low contact resistance, making Ag O-56 well suited for electronic contact applications. The process can be applied in rack, barrel, and high-speed systems, supporting a broad current density range from 0.6¨C50 ASD and up to 150 ASD for spot plating.
- Connectors
- Leadframes
- Wires
- Electronic contacts
- IC outer leads
- High-speed and low-speed plating applications
- Pure silver deposits with Type 1, Grade A classification according to ASTM B700.
- Semi-bright finish with the option to adjust toward full brightness.
- Low contact resistance for reliable electronic performance.
- Adjustable hardness and brightness to meet application-specific requirements.
- High conductivity for demanding electrical contact applications.
- Excellent solderability and bondability for electronic component manufacturing.
- Ductile deposits supporting reliable functional performance.
- Wide operating window for current densities between 0.6¨C50 ASD.
- Spot plating capability up to 150 ASD.
- Suitable for rack, barrel, and high-speed plating systems.
What inspires us
Why we developed Ag O-56
Your challenge
Manufacturers of electronic components require a versatile pure silver plating process that delivers high conductivity, solderability, and bondability. At the same time, deposit properties such as hardness and brightness must be adjustable to meet the performance requirements of electronic contacts and related applications.
Our solution
Ag O-56 provides a high-performance silver plating solution that produces uniform, semi-bright, and ductile deposits. With a wide applicable current density range and adjustable additive system, the process enables excellent conductivity, solderability, and bondability for electrical contact applications.
Contact Us