Anti EBO T14
A neutral pH post-treatment technology designed to eliminate or minimize epoxy bleed-out on silver, roughened copper, and ultrathin Ni/Pd/Au (PPF) surfaces
Neutral pH post-treatment
Enables effective epoxy bleed-out prevention on silver, roughened copper, and ultrathin Ni/Pd/Au (PPF) surfaces.
Hydrophobic surface mechanism
Uses surfactants to repel water-containing phases and restrict hydrophilic epoxy components from bleeding out.
Proven package compatibility
Demonstrated performance on QFN and TSSOP packages, including successful solderability testing with >95% solder coverage.
Strong resin bleed-out of an epoxy adhesive on a test pad vs no resin bleed-out
Epoxy bleed-out is a common challenge after die attachment and bonding operations, especially when filled adhesive systems are used. During processing, epoxy resin components can migrate from the bulk adhesive and contaminate surrounding surfaces, potentially affecting wire bonding performance and molding compound adhesion. Anti EBO T14 was developed to eliminate or significantly minimize this phenomenon.
Anti EBO T14 works as a neutral pH post-treatment step. Its surfactant-based mechanism creates a hydrophobic substrate surface that repels water-containing phases and prevents hydrophilic epoxy components from spreading across critical functional areas. The process is suitable for silver, roughened copper, and ultrathin Ni/Pd/Au (PPF) surfaces, supporting stable performance across key leadframe and semiconductor packaging applications.
- Leadframe manufacturing
- Die attach processes
- Wire bonding applications
- QFN and TSSOP packages
- Power semiconductor packages
- Automotive semiconductor manufacturing
- Silver, roughened copper, and ultrathin Ni/Pd/Au (PPF) final surfaces
- Applications where solid epoxy molds meet base materials
The hydrophobic surfactant pushes the water loving group or phase away, hydrophilic epoxy components are restricted from bleeding-out
- Minimizes or eliminates epoxy bleed-out after die attachment and bonding operations.
- Protects wire bonding areas by preventing the transfer of epoxy bleed-out onto leadframe points that require bonding.
- Supports good bond quality through improved surface cleanliness in critical bonding zones.
- Compatible with silver, roughened copper, and ultrathin Ni/Pd/Au (PPF) surfaces.
- Neutral pH post-treatment for integration into established surface finishing processes.
- Hydrophobic surface modification helps repel water-containing phases and restrict epoxy spread.
- Demonstrated solderability performance on QFN and TSSOP packages, achieving >95% solder coverage in dip-and-look tests.
- Validated with multiple epoxy systems, including epoxy resins tested on Ag and Ni/Pd/Au surfaces.
- Strong adhesion performance, with Anti EBO T14-treated Ag and Cu samples showing very good adhesion compared to benchmarked anti EBO chemistry.
- Qualified for demanding automotive applications, including use in power semiconductor manufacturing processes.
What inspires us
Why we developed Anti EBO T14
Your challenge
During die attachment and bonding, filled epoxy adhesives can release resin components that spread across the substrate surface. This epoxy bleed-out may contaminate areas required for wire bonding and molding compound adhesion, creating a risk for package reliability and process yield.
Our solution
Anti EBO T14 addresses this challenge through a surfactant-based, neutral pH post-treatment that forms a hydrophobic surface on the substrate. This surface repels water-containing phases and restricts hydrophilic epoxy components from bleeding out, helping maintain clean, bondable surfaces and reliable downstream assembly performance.
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